Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.

This heating device (100) includes: a heater (10) for heating an object (1) to be heated; a temperature detection unit (20) for detecting a temperature of the object (1) to be heated; and a temperature regulator (30) which controls the heater (10) so as to make the temperature of the object (1) to be heated equal to the target temperature. The temperature detection unit (20) comprises temperature sensors (21, 22). An identification unit (34) identifies, from temperature data detected by the temperature sensors (21, 22) and manipulation quantity data corresponding to electric power applied to the heater (10), a heat transfer function between the heater (10) and the temperature sensors (21, 22), and a heat transfer function between the respective temperature sensors (21, 22). A determination unit (36) detects a change of the transfer functions, and determines an abnormality in the heater (10) or the temperature sensors (21, 22).

A circuit board is disclosed that has a pre-warming function. The circuit board includes a substrate and one or more conductive paths embedded in the substrate. The one or more electrically conductive paths include a logic control circuit containing a heating element and a temperature-sensitive element configured to control the heating element and deliver an input when the temperature-sensitive element has reached a threshold temperature. The one or more electrically conductive paths further includes a heater power circuit configured to deliver power to the logic control circuit. The one or more electrically conductive paths further includes an operational power circuit configured to switch off power to the heater power circuit and switch on power to the operational power circuit upon a delivery of the input from the logic control circuit.

A manufacturing method of a sintered body is a manufacturing method of the sintered body which increases a temperature while applying an electric field to a ceramic compact. This method controls a current which flows to the ceramic compact so that a sintering rate becomes constant.

A system and method for providing power to moving elements on a conveyor system while the moving elements are moving. An accessory for mounting on one or more of the moving elements, which receives power from the system. Various accessories for using the power provided. In one case, the accessory is a rotary gripper that includes a body; a gripper motor; a rotation motor; and a plurality of grippers, wherein the gripper motor is mechanically connected with and configured to open and close the plurality of grippers, the rotation motor is mechanically connected with and configured to rotate the plurality of grippers. Other accessories include a gripper, a vacuum system, a heater, and a cooler.

Programmable temperature regulation circuits, and methods of operating programmable temperature regulation circuits, are disclosed for providing heat to a target area on a chip. The programmable temperature regulation circuits include a heating element on the chip, and a regulation loop operatively connected to the heating element. The regulation loop includes a first diode that measures the temperature in the target area, and an operational transconductance amplifier. The operational transconductance amplifier receives a reference temperature voltage from a reference voltage, and a temperature feedback voltage from the diode, and generates an output voltage to control the provision of electrical power to the heating element.

Disclosed is a personal vaping device provided with an electrical heating module as an atomizer or heater. The personal vaping device at least includes a power control circuit, which includes a current input terminal, a current input terminal, and a current control module. The power control circuit further includes a power supply control module, a current control module, a voltage modulation module, and a forward and reverse connection current generation module. The microprocessor is configured to control the voltage modulation module and the forward and reverse connection current generation module. The voltage modulation module is configured to regulate a voltage of the DC power supply to a first target voltage and a second target voltage. The forward and reverse connection current generation module is configured to generate a forward connection current and a reverse connection current according to the second target voltage to drive the atomizer or heater for heating.

A Faraday shielding apparatus includes a Faraday shielding plate and a heating circuit; the Faraday shielding plate includes a conductive ring and a plurality of conductive petal-shaped members radially symmetrically connected to the outer periphery of the conductive ring; when the heating circuit is used in the etching process, the Faraday shielding plate is heated by electricity. During the etching process, the heating circuit is conductively connected to the Faraday shielding plate, increasing the temperature of the Faraday shielding plate when it is energized, heating a medium window and reducing the amount of product deposits. During the cleaning process, the heating circuit and the Faraday shield are turned off, and the Faraday shielding plate is connected to a shielding power supply to clean the dielectric window. The output terminal of the heating power supply is filtered by way of a filter circuit unit, then connected to the Faraday shielding plate.

A semiconductor or other substrate can include one or more electrodes, located directly or indirectly on the substrate, separated from each other and coupled to the substrate. At the two or more electrodes, non-zero frequency time-varying electrical energy can be received. The time-varying electrical energy can be coupled via the two or more electrodes to trigger a displacement current to activate free carriers confined within the semiconductor substrate to generate frequency-controlled heat in the semiconductor substrate.

A method for controlling a power output from a screed heating control device for heating a screed device of a paver, the control device comprising: a power input connector device connectable to a remote electrical power source, a power output connector device connectable to the screed device, and a power adjustment unit configured to control the power at the power output connector device for heating the screed device by connecting/disconnecting the power output and power input connector devices, the method comprising: determining a maximum power input available at the power input connector device provided by the remote electrical power source, determining a desired power required for heating the screed device, and controlling the power adjustment unit to control the power from the screed heating control device for heating the screed device from the remote electrical power source depending on the maximum power input and the desired power output.