The invention relates to a method for operating a heating element (210), in particular in a food processor (1) for the at least partially automatic preparation of foodstuffs, wherein the following steps are performed: a) detecting an electrical resistance of the heating element (210) such that at least one resistance value is determined, b) performing a heating operation on the heating element (210) based on the at least one determined resistance value to perform the heating operation depending on a temperature of the heating element (210).

The invention relates to a method for operating a heating element (210), in particular in a food processor (1) for the at least partially automatic preparation of foodstuffs, wherein the following steps are performed: a) detecting an electrical resistance of the heating element (210) such that at least one resistance value is determined, b) performing a heating operation on the heating element (210) based on the at least one determined resistance value to perform the heating operation depending on a temperature of the heating element (210).

Autonomous hydraulic unit comprising a liquid inlet (1); a flow meter (2) which is jointly attached to an inlet (3) of a compression chamber (4) of a pump (5) where a piston (6) injects the compressed liquid through a nozzle (7) into a heating chamber (8).

A plastic body (9) integrates in one piece the compression chamber (4), a self-priming valve (10) and a safety valve (11). A heating element (12) contained within a body (9) determines with a disk (14) the heating chamber (8) where the temperature of the liquid injected by the piston (6) is raised in its passage towards the outlet (13).

Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

Systems and methods for user configurable cooking appliances include receiving system resources having associated budgets, facilitating user allocation the system resources to a plurality of heating elements without exceeding the associate budgets, applying the system resources to the heating elements to heat one or more food substances within a cooking chamber, and selectively regulating delivery of the system resources to the heating elements such that no more than the associated budget of each of the system resources is delivered to the heating elements. Computing components can execute a heating algorithm to cook at least one food substance in the cooking chamber, detect a state change of the food substance, and modify the heating algorithm to reconfigure the system resources supplied to the heating elements in response to the state change and in accordance with user configured allocation and associated budgets for the system resources.

An oven appliance is provided with features for locking out a cooking chamber to boost the preheat performance of and thereby decrease the time required to preheat another cooking chamber of the oven appliance. A method for operating an oven appliance also is provided. The method includes features for locking out a cooking chamber to boost the preheat performance of and thereby decrease the time required to preheat another cooking chamber of the oven appliance.

Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

A heating and cooking apparatus inside the cooking chamber of a 3D food printer includes a laser cooking apparatus controlled by a processor implementing particular computer program instructions specific to the operation of the heating and cooking apparatus. The laser cooking apparatus includes at least one laser system with at least one laser beam able to heat the food product to its cooking temperature. Each laser system provides two or more laser beams, each of which can be deflected and focused into the food product with a beam spot of adjustable diameter. The heating and cooking apparatus also can include an electromagnetic radiation heating apparatus that is controlled by the processor and emits electromagnetic radiation to warm the food product inside the cooking chamber to a temperature below its cooking temperature.

Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

Several embodiments include a cooking appliance/instrument (e.g., oven). The cooking appliance/instrument can include a cooking chamber, a support tray adapted to hold food in the cooking chamber; and a heating system comprised of at least a heating element. The heating system is adapted to emit waves according to a particular configuration such that the emitted waves is substantially transparent or substantially opaque to the support tray and thus enabling the cooking instrument to select what to heat.