A positive temperature coefficient component includes: a substrate (32); a conductive ink (36) disposed over at least a portion of the substrate (32); a positive temperature coefficient layer (38) disposed over at least a portion of the substrate (32) and/or the conductive ink (36); and a topcoat layer (42) formed from a coating composition including a dielectric material disposed over at least a portion of the positive temperature coefficient layer (38) and/or the conductive ink (36).

A substrate support includes a heater body, a heater element, and a heater terminal. The heater body is formed from a ceramic material and has upper and lower surfaces separated by a thickness. The heater element is arranged between the upper and lower surfaces and is embedded within the ceramic material forming the heater body. The heater terminal is arranged between the upper and lower surfaces, is electrically connected to the heater element, and has an electrode surface and a rounded surface. The electrode surface opposes the lower surface to flow an electric current to the heater element. The rounded surface opposes the upper surface and is embedded within the ceramic material to limit stress within the ceramic material during heating of a substrate seated on the upper surface of the heater body. Semiconductor processing systems and methods of making substrate supports for semiconductor processing systems are also described.

A household appliance is configured to implement an automatic cycle of operation for treating an article. The household appliance includes a treating chamber configured to receive the article for treatment according to the automatic cycle of operation. A sump is fluidly coupled to the treating chamber. A liquid circuit is fluidly coupled to at least one of the treating chamber or the sump. An immersible heater is located within the sump.

An electric heating module structure, an installation method, a forming method, and a wind turbine are provided. The electric heating module structure is configured for melting ice on a blade, and includes an electric heating module, a positive conductive wire and a negative conductive wire. The positive conductive wire and the negative conductive wire are integrally formed with the electric heating module, to supply power to the electric heating module. The integrally formed electric heating module, the positive conductive wire and the negative conductive wire are laid in an outer layer of the blade.

Disclosed is a first method of providing a heating system to an outer skin of an aircraft, that has the steps of forming laser-induced graphene (LIG) on a polymer sheet by directing laser energy towards the polymer sheet; coupling electrical leads to the LIG; and bonding the polymer sheet against the outer skin or erosion protection layer secured to the outer skin so that to the polymer sheet conforms with a shape of the outer skin.

An infrared heating apparatus includes a sheet of ceramic glass having a passband in the infrared spectrum, a metal resistive element having a first portion that is covered by a ceramic refractory material and a second portion that is exposed by the ceramic refractory material, and a controller that controls the metal resistive element to emit infrared radiation in a wavelength corresponding to the passband of the ceramic glass.

A method for manufacturing a heatable plastic component for a motor vehicle, which includes: providing a planar heating film, which has a first surface and a second surface that faces away from and is opposite the first surface, including at least one heating wire and connecting elements; introducing the planar heating film into an injection mold; mounting a connector housing onto the connecting elements; and back-molding the first surface with a plastic for manufacturing a first partial element of the heatable plastic component in the injection mold. In order to provide an improved method for manufacturing a heatable plastic component, it is proposed that a back-molding of the second surface with a plastic for manufacturing a second partial element of the heatable plastic component in the injection mold takes place such that a composite is formed from the first partial element, the planar heating film and the second partial element.

A workstation for a film-processing packaging machine defines a film transport plane in which the packaging film can be transported. In addition, the workstation comprises an electrically operable heating assembly. The latter in turn comprises an electrically conductive planar resistance heating element which in a plane parallel to the film transport plane has dimensions that are greater by a factor of at least 5, preferably at least 10, than in a direction perpendicular to the film transport plane. The resistance heating element is arranged between a heating plate and a clamping plate. The disclosure also relates to a packaging machine with such a workstation and to a method for operating such a workstation.

A member for a semiconductor manufacturing apparatus includes a disk-shaped or annular ceramic heater, a metal base, an adhesive element bonding the metal base and the ceramic heater, an adhesive protective element disposed between the ceramic heater and the metal base to extend along a periphery of the adhesive element, and an anti-adhesion layer disposed between the adhesive element and the protective element, the anti-adhesion layer preventing adhesion between the adhesive element and the protective element.

An electrostatic chuck heater includes a resistance heating element. A region of the resistance heating element from one end to another end of the resistance heating element is divided into a plurality of sections. Recessed grooves are provided in the respective sections along a longitudinal direction of the resistance heating element in a surface. In a connection portion between the recessed grooves that are provided in the adjacent sections, a projection portion that extends along the connection portion is provided.