Patent classifications
H05B3/68
Temperature regulated preparation and storage system
A temperature-regulated apparatus for food and drink preparation and storage, particularly for refrigeration and sous vide cooking. The apparatus is preferably a consumer electronic device comprising a compartment, base, reservoir, tube network, heating and cooling element, and an air pump system. The apparatus is controlled electronically and wirelessly in connection with a hardware and software system.
Temperature regulated preparation and storage system
A temperature-regulated apparatus for food and drink preparation and storage, particularly for refrigeration and sous vide cooking. The apparatus is preferably a consumer electronic device comprising a compartment, base, reservoir, tube network, heating and cooling element, and an air pump system. The apparatus is controlled electronically and wirelessly in connection with a hardware and software system.
Method for a cooktop
In a method for a cooktop, in particular for producing and/or operating the cooktop, which has at least one variable cooking surface, the cooking surface is partitioned in an operating mode along a partitioning direction into a plurality of heating zones to which at least one heating parameter is assigned in each case in a location-dependent manner in order to heat a cooking utensil that is deposited on the heating zone. In order to ensure flexible production and/or flexible operation of the cooktop, during partitioning of the cooking surface into the heating zones in at least one peripheral region of the cooking surface, at least one cooking utensil characteristic is taken into account.
Method for a cooktop
In a method for a cooktop, in particular for producing and/or operating the cooktop, which has at least one variable cooking surface, the cooking surface is partitioned in an operating mode along a partitioning direction into a plurality of heating zones to which at least one heating parameter is assigned in each case in a location-dependent manner in order to heat a cooking utensil that is deposited on the heating zone. In order to ensure flexible production and/or flexible operation of the cooktop, during partitioning of the cooking surface into the heating zones in at least one peripheral region of the cooking surface, at least one cooking utensil characteristic is taken into account.
Uniform heat distribution in resistive heaters for anti-icing and de-icing
Configurations are described that provide uniform heat distribution of resistive heaters. These configurations allow successful anti-icing and deicing with relatively low applied power. One aspect involves the use of a thin film heater applied just underneath the topcoat to efficiently direct all heat to the surface, allowing anti-icing and de-icing with minimal power. This can be accomplished by employing a hybrid electrode interface, using a metal foil or metal braid that is attached to the aircraft surface with a structural adhesive that has been smoothed along the edges with metal-filled adhesive. Another aspect uses an array of heater cells created as a single sheet and a heat spreading material, provided underneath or overtop of the heater cells.
Plasma processing apparatus and temperature control method
A plasma processing apparatus includes a stage having a placing surface on which a workpiece is accommodated; a heater provided in the stage and configured to adjust a temperature of the placing surface of the stage; and a controller. The controller is configured to control a supply power to the heater; measure the supply power in a transient state where the supply power to the heater increases and in a second steady state where the supply power to the heater is stable in an extinguished state of plasma; calculate a heat input amount and a heat resistance by performing a fitting on a calculation model that calculates the supply power in the transient state using the heat input amount from the plasma and the heat resistance between the workpiece and the heater as parameters; and calculate a temperature of the workpiece in the first steady state.
Lockable Food Delivery Box Apparatus
A lockable food delivery box apparatus for preventing food tampering and contamination includes an insulated box defining a storage cavity configured to store food items for delivery. A box lid is selectively engageable with an open side of the insulated box. An electronic lock is coupled to the insulated box and is in operational communication with the box lid to secure and alternatively free the box lid. The electronic lock has a transceiver configured to be in operational communication with a smartphone. A heating coil is coupled to the insulated box to raise the temperature within the storage cavity. A cooling system is coupled to the insulated box to lower the temperature within the storage cavity. A power supply is coupled within the insulated box and is in operational communication with the heating coil, the cooling system, and the electronic lock.
Lockable Food Delivery Box Apparatus
A lockable food delivery box apparatus for preventing food tampering and contamination includes an insulated box defining a storage cavity configured to store food items for delivery. A box lid is selectively engageable with an open side of the insulated box. An electronic lock is coupled to the insulated box and is in operational communication with the box lid to secure and alternatively free the box lid. The electronic lock has a transceiver configured to be in operational communication with a smartphone. A heating coil is coupled to the insulated box to raise the temperature within the storage cavity. A cooling system is coupled to the insulated box to lower the temperature within the storage cavity. A power supply is coupled within the insulated box and is in operational communication with the heating coil, the cooling system, and the electronic lock.
Multi-zone heater model-based control in semiconductor manufacturing
A plurality of heating zones in a substrate support assembly in a chamber is independently controlled. Temperature feedback from a plurality of temperature detectors is provided as a first input to a process control algorithm, which may be a closed-loop algorithm. A second input to the process control algorithm is targeted values of heater temperature for one or more heating zones, as calculated using a model. Targeted values of heater power needed for achieving the targeted values of heater temperature for the one or more heating zones is calculated. Chamber hardware is controlled to match the targeted value of heater temperature that is correlated with the wafer characteristics corresponding to the current optimum values of the one or more process parameters.
Embossed feature for cooktop assembly
A cooktop assembly includes a burner box and a controller disposed on the burner box. A mounting panel is coupled to the burner box over the controller. The mounting panel defines a plurality of embossed features. Each of the plurality of embossed features extends vertically upward from discrete portions of the mounting panel. A plurality of coil assemblies includes individual coil assemblies. Each of the individual coil assemblies includes a coil disposed on a coil plate that defines more than one aperture. Each of the individual embossed features extends through an aperture of the more than one aperture defined by one of the coil plates when the individual coil assemblies are disposed on the mounting panel. A cooktop is disposed over the plurality of coil assemblies and coupled to the burner box.