Provided are entropy encoding and entropy decoding for video encoding and decoding. The video entropy decoding method includes: determining a bin string and a bin index for a maximum coding unit that is obtained from a bitstream; determining a value of a syntax element by comparing the determined bin string with bin strings that is assignable to the syntax element in the bin index; storing context variables for the maximum coding unit when the syntax element is a last syntax element in the maximum coding unit, a dependent slice segment is includable in a picture in which the maximum coding unit is included, and the maximum coding unit is a last maximum coding unit in a slice segment; and restoring symbols of the maximum coding unit by using the determined value of the syntax element.

The present invention relates to a dish warming system that includes a plurality of dish warming assemblies each having a plate with a power source and a heat element. The power source of each dish warming assembly allows for the concurrent charging of the plurality of dish warming assemblies while stacked. The heat element in some iterations of the system includes a pressure switch that activates the heat element when a dish is placed on the dish warming assembly.

A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.

A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.

A thermal management unit includes a panel and a cooling element. The panel is manufactured from a thermally conductive metallic material. The cooling element is configured to perform a cooling operation. The cooling element is positioned to selectively cool the panel.

A heating and cooling unit includes a panel, a heating assembly configured to heat the panel as part of a heating operation, and a cooling assembly configured to cool the panel as part of a cooling operation. The heating assembly includes a first plate disposed along a first side of the panel, the first plate having a body that defines a slot. The heating assembly further includes a heating element disposed within the slot. The cooling assembly includes a second plate coupled to the first plate and a cooling element coupled to the second plate. The panel, the heating assembly, and the cooling assembly are arranged in a stacked configuration with the heating assembly between the panel and the cooling assembly.

Provided are entropy encoding and entropy decoding for video encoding and decoding. The video entropy decoding method includes: determining a bin string and a bin index for a maximum coding unit that is obtained from a bitstream; determining a value of a syntax element by comparing the determined bin string with bin strings that is assignable to the syntax element in the bin index; storing context variables for the maximum coding unit when the syntax element is a last syntax element in the maximum coding unit, a dependent slice segment is includable in a picture in which the maximum coding unit is included, and the maximum coding unit is a last maximum coding unit in a slice segment; and restoring symbols of the maximum coding unit by using the determined value of the syntax element.

A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.

A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.

An embodiment of the present invention discloses a heating plate comprising a cast iron blank, a heat generating tube and a heat insulating powder layer. Wherein the upper surface of the cast iron blank is provided with a recess for placing a heat generating tube. Thereof a heat-generating tube is pressing-fitted into the recess and is fitted with the recess, and both ends of the heat-generating tube are respectively provided with a leading pin perpendicular to the horizontal plane. And the upper surface of the heat-insulating powder layer where is provided two pin holes respectively connected with the heat generating tube leading pins, and the leading pins pass through the lead pin holes. And it is an object of the present invention to provide a heating plate with high efficiency and high reliability.