The present disclosure discloses a heating apparatus for a semiconductor device. The heating apparatus includes a carrier including a first abutting part, a heat collecting plate at least including a working surface, and a heat radiation source disposed on a side of the heat collecting plate opposite to the working surface and separated from the heat collecting plate by a predetermined distance. The heat collecting plate is disposed on the carrier, and the first abutting part abuts against an edge of the heat collecting plate on the side opposite to the working surface. The heat radiation source is and configured to emit heat radiation during working and to heat the heat collecting plate in a non-contact manner. The heat collecting plate receives the heat radiation and the emitted heat and heats a heated object disposed on the working surface in a contact manner.

A cooktop is provided that includes a glass ceramic cooking plate that exhibits enhanced mechanical strength and at the same time increased spectral transmittance in the infrared range. The glass ceramic cooking plate makes it possible to detect, through the glass ceramic cooking plate, the temperature of a piece of cookware placed thereon using an infrared sensor, and to perform an automated cooking process in response thereto.