An infrared heating mechanism and device are provided. The infrared heating mechanism includes infrared heating tubes, wherein a plurality of reflection plates are disposed at intervals in a length direction of the infrared heating tubes, and mounting holes corresponding to the infrared heating tubes are provided on the reflection plates so that the reflection plates are sleeved on side walls of the infrared heating tubes.

An infrared heating mechanism and device are provided. The infrared heating mechanism includes infrared heating tubes, wherein a plurality of reflection plates are disposed at intervals in a length direction of the infrared heating tubes, and mounting holes corresponding to the infrared heating tubes are provided on the reflection plates so that the reflection plates are sleeved on side walls of the infrared heating tubes.

A semiconductor fabrication system includes a wafer carrier configured to carry a wafer thereon. A radiation source is positioned above the wafer carrier. The radiation source is configured to emit thermal radiation. A plurality of reflectors is positioned above, and aligned with, an edge region of the wafer. The reflectors each have a reflective coating configured to reflect the thermal radiation. A plurality of separately-controllable motors is coupled to the reflectors, respectively. The motors are each configured to cause its respective reflector to rotate in a counterclockwise direction or a clockwise direction so as to redirect the thermal radiation back toward the edge region of the wafer. A controller is communicatively coupled to the plurality of motors. The controller is configured to control each of the motors separately to cause each motors to rotate independently of other motors.

A semiconductor fabrication system includes a wafer carrier configured to carry a wafer thereon. A radiation source is positioned above the wafer carrier. The radiation source is configured to emit thermal radiation. A plurality of reflectors is positioned above, and aligned with, an edge region of the wafer. The reflectors each have a reflective coating configured to reflect the thermal radiation. A plurality of separately-controllable motors is coupled to the reflectors, respectively. The motors are each configured to cause its respective reflector to rotate in a counterclockwise direction or a clockwise direction so as to redirect the thermal radiation back toward the edge region of the wafer. A controller is communicatively coupled to the plurality of motors. The controller is configured to control each of the motors separately to cause each motors to rotate independently of other motors.