A device for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, includes a system for fastening a plate during the soldering operation, at least one soldering tool having at least one induction loop or induction coil suitable for emitting a magnetic field, a system for mutually positioning the soldering tool and the contact element such that the switched-on magnetic field of the soldering tool reliably heats the ferromagnetic contact element and thus the solder joint, a generator that is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and that can be connected to the induction loop or induction coil.

An induction heatable cartridge for use with an induction heating assembly includes a solid vaporisable substance and at least one ring-shaped induction heatable susceptor held within and surrounded by the vaporisable substance. The susceptors are held in position such that, when the cartridge is positioned in an induction circuit in use, different regions of the outer edge of the one or more susceptors are at different distances from the induction circuit to provide different heating characteristics in the different regions. The centres of each of the at least one susceptors are aligned along a common axis.

An induction heatable cartridge for use with an induction heating assembly includes a solid vaporisable substance and at least one ring-shaped induction heatable susceptor held within and surrounded by the vaporisable substance. The susceptors are held in position such that, when the cartridge is positioned in an induction circuit in use, different regions of the outer edge of the one or more susceptors are at different distances from the induction circuit to provide different heating characteristics in the different regions. The centres of each of the at least one susceptors are aligned along a common axis.

A connecting method includes: measuring at least one of control dimensions that influence a dimension of a member obtained by connection of a first member and a second member to each other, the second member including a connection insertion portion where the first member is inserted; determining, according to the at least one of the control dimensions, a relative position for positioning the first member and the second member by insertion of the first member in the connection insertion portion; heating the second member to a first temperature; inserting the first member in the connection insertion portion to place the first member and the second member in the relative position; and stopping the heating of the second member and maintaining the first member and the second member in the relative position.

The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.

An aerosol-generating device includes a susceptor arranged to be inserted into an aerosol-generating substrate, a coil configured to heat the susceptor by induction heating, a magnetic force detector configured to detect a change in magnetic force of the susceptor according to a temperature change, and a controller configured to calculate a temperature of the susceptor based on the change of the magnetic force detected by the magnetic force detector. Accordingly, the aerosol-generating device accurately measures the temperature of the susceptor in a non-contact manner.

A heating apparatus, a method and a system for producing semiconductor chips in a wafer assembly are disclosed. In an embodiment a method for producing semiconductor chips in a wafer composite includes providing a carrier having a wafer plane and a reference point, wherein the carrier is configured to accommodate at least one wafer composite in the wafer plane, providing a heating device comprising a heating plane and a first heating unit arranged laterally offset from the reference point in the heating plane, and arranging the heating device with its heating plane parallel to the wafer plane, arranging at least one wafer composite in the wafer plane of the carrier, rotating the carrier and the heating device relative to each other about an axis perpendicular to the heating plane and the wafer plane through the reference point, controlling the first heating unit such that a temperature of the carrier is influenced, providing a bending sensor for determining a bending characteristic value, the bending characteristic value being representative of a bending of the at least one wafer composite relative to the wafer plane and controlling the first heating unit based on the bending characteristic value.

An induction heating system includes interchangeable secondary induction heating assemblies and/or secondary induction heating coil flux concentrators that are specifically configured for the particular type of weld being created and/or the particular weld joint where the weld is created. For example, the secondary induction heating assemblies and/or secondary induction heating coil flux concentrators may have specific physical configurations (e.g., shapes, contours, etc.) and/or include specific materials (e.g., ferrites) that are well suited for the particular type of weld being created and/or the particular weld joint where the weld is created. In certain embodiments, a robotic positioning system may be configured to move the secondary induction heating coil to an induction heating coil changing station to, for example, detach the secondary induction heating coil, and attach another secondary induction heating coil, thereby facilitating different secondary induction heating coils to be used for induction heating of different types of welds, for example. In addition, in certain embodiments, the robotic positioning system may be configured to move the secondary induction heating coil to the induction heating coil changing station to, for example, detach the secondary induction heating coil flux concentrator, and attach another secondary induction heating coil flux concentrator.

An induction heating system includes interchangeable secondary induction heating assemblies and/or secondary induction heating coil flux concentrators that are specifically configured for the particular type of weld being created and/or the particular weld joint where the weld is created. For example, the secondary induction heating assemblies and/or secondary induction heating coil flux concentrators may have specific physical configurations (e.g., shapes, contours, etc.) and/or include specific materials (e.g., ferrites) that are well suited for the particular type of weld being created and/or the particular weld joint where the weld is created. In certain embodiments, a robotic positioning system may be configured to move the secondary induction heating coil to an induction heating coil changing station to, for example, detach the secondary induction heating coil, and attach another secondary induction heating coil, thereby facilitating different secondary induction heating coils to be used for induction heating of different types of welds, for example. In addition, in certain embodiments, the robotic positioning system may be configured to move the secondary induction heating coil to the induction heating coil changing station to, for example, detach the secondary induction heating coil flux concentrator, and attach another secondary induction heating coil flux concentrator.

An aerosol-forming article includes: an aerosol-forming substrate; a heating layer encircling a concave portion, the aerosol-forming substrate being arranged in the concave portion; and a cover layer covering at least a part of the heating layer and an opening of the concave portion. The aerosol-forming substrate is located between the heating layer and the cover layer. A through hole is provided at a position of the cover layer corresponding to the opening. The heating layer generates eddy currents in a magnetic field to generate heat so as to heat the aerosol-forming substrate to form aerosols.