H05F1/02

Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

Optical fiber

An optical fiber comprises a glass fiber comprising a core and a cladding, and a coating resin layer covering the outer periphery of the glass fiber, wherein the coating resin layer has a primary resin layer being in contact with the glass fiber and covering the glass fiber and a secondary resin layer covering the outer periphery of the primary resin layer, the secondary resin layer comprises hydrophobic spherical silica particles, and the content of the silica particles is 7% by mass or more and 60% by mass or less based on the total amount of the secondary resin layer, and the absolute value of the surface potential of the optical fiber is 10 mV or more and 60 mV or less.

MULTILAYERED FILM, METHOD FOR PRODUCING SAME, AND USE THEREOF
20230119647 · 2023-04-20 · ·

To provide a piezoelectric film that is less likely to be electrified and that can be safely handled. A multilayered film according to an embodiment of the present invention including: a piezoelectric film containing polyvinylidene fluoride; and a protective film including an antistatic layer, the piezoelectric film and the protective film being bonded.

Electrostatic Inhibiting Application Device
20170231357 · 2017-08-17 · ·

A device for the treatment of the surfaces of people, animals, or objects for the purpose of inhibiting the accumulation and discharge of electrostatic energy. The invention is comprised of a handle (1) or base or some other structural support accompanied by a replaceable a dryer sheet (4). Dryer sheet (4) will be constrained in such a way that it can be easily manipulated into physical contact with the user of the device, an animal, or some other object. Using the device causes the electrostatic inhibiting properties of a dryer sheet (4) to be transferred directly to the target object, person, or animal.

Electrostatic Inhibiting Application Device
20170231357 · 2017-08-17 · ·

A device for the treatment of the surfaces of people, animals, or objects for the purpose of inhibiting the accumulation and discharge of electrostatic energy. The invention is comprised of a handle (1) or base or some other structural support accompanied by a replaceable a dryer sheet (4). Dryer sheet (4) will be constrained in such a way that it can be easily manipulated into physical contact with the user of the device, an animal, or some other object. Using the device causes the electrostatic inhibiting properties of a dryer sheet (4) to be transferred directly to the target object, person, or animal.

Conductive nanostructure-based films with improved ESD performance
09763313 · 2017-09-12 · ·

Optical stacks containing one or more patterned transparent conductor layers may be damaged by electrostatic discharges that occur during the optical stack manufacturing process. Such damage may result in non-conductive conductors within the patterned transparent conductor layer. An electrostatic discharge protected optical stack may include a substrate layer, a first anti-static layer having a sheet resistance of from about 10.sup.6 ohms per square (Ω/sq) to about 10.sup.9 Ω/sq, and a patterned transparent conductor layer. Methods of testing and assessing damage to patterned transparent conductors are provided.

Conductive nanostructure-based films with improved ESD performance
09763313 · 2017-09-12 · ·

Optical stacks containing one or more patterned transparent conductor layers may be damaged by electrostatic discharges that occur during the optical stack manufacturing process. Such damage may result in non-conductive conductors within the patterned transparent conductor layer. An electrostatic discharge protected optical stack may include a substrate layer, a first anti-static layer having a sheet resistance of from about 10.sup.6 ohms per square (Ω/sq) to about 10.sup.9 Ω/sq, and a patterned transparent conductor layer. Methods of testing and assessing damage to patterned transparent conductors are provided.