A power supply apparatus for an X-ray imaging apparatus includes grid connection device(s) to connect to a power grid providing an AC input voltage, including circuit protection arrangement(s) to not trip below a safety current; an actively actuatable transformer arrangement to transform the AC input voltage into a DC output voltage as a supply voltage for the X-ray imaging apparatus; an electrical energy storage system; and a control apparatus to actuate the transformer arrangement to limit power consumption from the electric power grid as a function of the safety current and make up for a deficiency of a power requirement for the X-ray imaging apparatus from the energy storage system. The control apparatus is configured to actuate the transformer arrangement for time-dependent limitation of power consumption from the power grid according to a current/time profile, the current/time profile being deduced from a time-based trip profile of the circuit protection arrangement.

A power supply apparatus for an X-ray imaging apparatus includes grid connection device(s) to connect to a power grid providing an AC input voltage, including circuit protection arrangement(s) to not trip below a safety current; an actively actuatable transformer arrangement to transform the AC input voltage into a DC output voltage as a supply voltage for the X-ray imaging apparatus; an electrical energy storage system; and a control apparatus to actuate the transformer arrangement to limit power consumption from the electric power grid as a function of the safety current and make up for a deficiency of a power requirement for the X-ray imaging apparatus from the energy storage system. The control apparatus is configured to actuate the transformer arrangement for time-dependent limitation of power consumption from the power grid according to a current/time profile, the current/time profile being deduced from a time-based trip profile of the circuit protection arrangement.

A method for providing temperature information that relates to an inverter assembly having an inverter and a cooling body, comprises: receiving power loss data that relates to the inverter; receiving a set of thermodynamic coefficients that relates to a heating of the inverter, which is caused by power loss, a conduction of heat from the inverter to the cooling body and a transfer of heat from the cooling body to a cooling fluid; receiving cooling fluid temperature data that relates to the cooling fluid; calculating the temperature information based on the power loss data, the set of thermodynamic coefficients and the cooling fluid temperature data; and providing the temperature information.

A method for providing temperature information that relates to an inverter assembly having an inverter and a cooling body, comprises: receiving power loss data that relates to the inverter; receiving a set of thermodynamic coefficients that relates to a heating of the inverter, which is caused by power loss, a conduction of heat from the inverter to the cooling body and a transfer of heat from the cooling body to a cooling fluid; receiving cooling fluid temperature data that relates to the cooling fluid; calculating the temperature information based on the power loss data, the set of thermodynamic coefficients and the cooling fluid temperature data; and providing the temperature information.

Provided is an X-ray imaging system capable of performing X-ray imaging quickly. The X-ray imaging system is provided with: an X-ray tube device including a cathode and an anode, the X-ray tube device being capable of performing X-ray imaging by irradiating an imaging target with X-rays in a state of rotating the anode; a light irradiation device including a collimator defining an X-ray irradiation range of the X-rays with respect to the imaging target, a visible light irradiation unit for emitting visible light to the imaging target and a light irradiation operation unit for performing an operation for making the visible light irradiation unit in the light irradiation state; and a controller for controlling operations of the X-ray tube device and the light irradiation device. The controller rotates the anode at an imaging possible rotation speed capable of performing X-ray imaging when the light irradiation operation unit is operated.

Provided is an X-ray imaging system capable of performing X-ray imaging quickly. The X-ray imaging system is provided with: an X-ray tube device including a cathode and an anode, the X-ray tube device being capable of performing X-ray imaging by irradiating an imaging target with X-rays in a state of rotating the anode; a light irradiation device including a collimator defining an X-ray irradiation range of the X-rays with respect to the imaging target, a visible light irradiation unit for emitting visible light to the imaging target and a light irradiation operation unit for performing an operation for making the visible light irradiation unit in the light irradiation state; and a controller for controlling operations of the X-ray tube device and the light irradiation device. The controller rotates the anode at an imaging possible rotation speed capable of performing X-ray imaging when the light irradiation operation unit is operated.

Methods and systems for measuring structural and material characteristics of semiconductor structures based on combined x-ray reflectometry (XRR) and x-ray photoelectron spectroscopy (XPS) are presented herein. A combined XRR and XPS system includes an x-ray illumination source and x-ray illumination optics shared by both the XRR and XPS measurement subsystems. This increases throughput and measurement accuracy by simultaneously collecting XRR and XPS measurement data from the same area of the wafer. A combined XRR and XPS system improves measurement accuracy by employing XRR measurement data to improve measurements performed by the XPS subsystem, and vice-versa. In addition, a combined XRR and XPS system enables simultaneous analysis of both XRR and XPS measurement data to more accurately estimate values of one of more parameters of interest. In a further aspect, any of measurement spot size, photon flux, beam shape, beam diameter, and illumination energy are independently controlled.

Methods and systems for measuring structural and material characteristics of semiconductor structures based on combined x-ray reflectometry (XRR) and x-ray photoelectron spectroscopy (XPS) are presented herein. A combined XRR and XPS system includes an x-ray illumination source and x-ray illumination optics shared by both the XRR and XPS measurement subsystems. This increases throughput and measurement accuracy by simultaneously collecting XRR and XPS measurement data from the same area of the wafer. A combined XRR and XPS system improves measurement accuracy by employing XRR measurement data to improve measurements performed by the XPS subsystem, and vice-versa. In addition, a combined XRR and XPS system enables simultaneous analysis of both XRR and XPS measurement data to more accurately estimate values of one of more parameters of interest. In a further aspect, any of measurement spot size, photon flux, beam shape, beam diameter, and illumination energy are independently controlled.

The present disclosure relates to a method and system for adjusting a focal point position of an X-ray tube. The method may include: obtaining a first thermal capacity and a first position of a focal point of an X-ray tube; obtaining a second thermal capacity of the X-ray tube; determining a second position of the focal point the X-ray tube based on the second thermal capacity; determining a target grid voltage difference of a focusing cup of the X-ray tube based on the first position and the second position of the focal point; and adjusting the X-ray tube based on the target grid voltage difference.

The present disclosure relates to a method and system for adjusting a focal point position of an X-ray tube. The method may include: obtaining a first thermal capacity and a first position of a focal point of an X-ray tube; obtaining a second thermal capacity of the X-ray tube; determining a second position of the focal point the X-ray tube based on the second thermal capacity; determining a target grid voltage difference of a focusing cup of the X-ray tube based on the first position and the second position of the focal point; and adjusting the X-ray tube based on the target grid voltage difference.