A system for controlling temperatures within a rearview assembly may comprise a rearview assembly having a housing defining an opening and at least one of a display element and an electro-optic element disposed in the opening; and an in-cabin monitoring system comprising at least one printed circuit board; an imager disposed on one of the at least one printed circuit boards, an image signal processor in communication with the imager, at least one light source, and at least one heat spreader positioned within the housing. The heat spreader may be stamped aluminum. The imager may be at a distance from the at least one light source.

A data storage device includes a memory module including a circuit board, a plurality of light emitting elements and a light guiding unit. The light emitting elements are electrically connected to the circuit board. The light guiding unit includes a light-homogenizing plate and a light output portion. The plate is disposed between the light output portion and the light emitting elements. A light diffusion space is disposed between the plate and the light output portion. The light emitted by the light emitting elements propagates sequentially into the plate, the light diffusion space, and the light output portion and then is output through the light output portion.

A circuit module (e.g., an amplifier module) includes a module substrate, a thermal dissipation structure, a semiconductor die, encapsulant material, and an interposer. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The thermal dissipation structure extends through the module substrate, and a surface of the thermal dissipation structure is exposed at the mounting surface of the module substrate. The semiconductor die is coupled to the surface of the thermal dissipation structure. The encapsulant material covers the mounting surface of the module substrate and the semiconductor die, and a surface of the encapsulant material defines a contact surface of the circuit module. The interposer is embedded within the encapsulant material. The interposer includes a conductive terminal with a proximal end coupled to a conductive pad of the module substrate, and a distal end exposed at the contact surface of the circuit module.

Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.

A wiring substrate includes: an insulating substrate including a base portion comprising a through hole having a first opening and a second opening, and a frame portion located on the base portion; and a heat dissipator disposed on a side of the base portion that is opposite to the frame portion so as to block the second opening, wherein an inner surface of the through hole faces a side surface of the heat dissipator with a clearance being provided between the inner surface of the through hole and the side surface of the heat dissipator.

A substrate module according to an embodiment of the present invention comprises: a first substrate which includes transformer connection part to be connected to terminals of a transformer, at least one second substrate on which a switch module to be connected to the transformer is formed; and a conductive connector which connects the first substrate and the second substrate to each other, wherein the first substrate and the second substrate are arranged by the conductive connector such that a predetermined angle is formed therebetween.

A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1=3˜65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2=0.02˜3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3=0.02˜1.0 W/m.K. A circuit board and its manufacturing method are also provided.

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

Provided is a circuit assembly that enables suppression of a decrease in heat dissipation properties. A circuit assembly includes a circuit board having a conductive path, a heat dissipation member on which the circuit board is placed, and an insulating layer that is interposed between the circuit board and the heat dissipation member. A surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.

Provided is an onboard control apparatus (ECU) having a thermal radiating coating film capable of efficiently radiating heat generated from an electronic component to the outside of the casing. An onboard control apparatus includes: a circuit board stored in a housing; an electronic component mounted on the circuit board; and a thermal radiating coating film which is disposed on the electronic component to radiate heat generated from the electronic components, wherein the thermal radiating coating includes a resin and thermal radiating particles which radiate heat, and the thermal radiating particles and the resin have substantially same specific gravity.