In a connector assembly in which a first connector that includes a first insulator, first terminals, and a first shell and is mounted on a first board and a second connector that includes a second insulator, second terminals, and a second shell and is mounted on a second board are connected with each other, a first ground pattern that has a frame-like shape and is formed on the first board is soldered to the first shell with first solder, and a second ground pattern that has a frame-like shape and is formed on the second board is soldered to the second shell with second solder. An inner space in which the first terminals and the second terminals are positioned is completely shielded from the outside without any gap.

A method for manufacturing a flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes providing an inner wiring board including a first conductive wiring layer and a first substrate layer, the first conductive wiring layer including a signal line and two ground lines on both sides of the signal line, the first substrate layer covering a side of the first conductive wiring layer and defining first through holes which expose the signal line; providing two copper clad laminates including a second substrate layer and a copper foil, the second substrate layer having second through hole aligned with the first through holes; laminating the two copper clad laminates onto two sides of the inner wiring board via two adhesive layers, each adhesive layer defining third through holes aligned with the first and second through holes; and forming a second conductive wiring layer from the copper foil.

An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.

The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

A wiring board with a filter circuit includes an insulating base, a conductor pattern, and a filter circuit. The conductor pattern is provided on the insulating base and defines the filter circuit. The insulating base includes an intermediate member, and first through third end members connected to the intermediate member. A first external connection terminal is provided on the first end member, and is disposed on a first end of the conductor pattern in the signal transmission direction. A second external connection terminal is provided on the second end member, and is disposed on a second end of the conductor pattern in the signal transmission direction. A first ground connection terminal that grounds the filter circuit is provided on the intermediate member. A second ground connection terminal that grounds the filter circuit is provided on the third end member.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Disclosed is a flexible PCB RF cable having a ground pattern that is divided into two ground patterns, which are connected through a connection pattern arranged in an area overlapped with a signal line pattern, and thus cracks are minimized during bending. The disclosed flexible PCB RF cable comprises: a signal line pattern interposed between a first dielectric sheet and a second dielectric sheet; first and second lower ground patterns, which are mesh patterns arranged to be spaced from each other below the first dielectric sheet; a lower connection pattern connected to the first and second lower ground patterns; first and second upper ground patterns, which are mesh patterns arranged to be spaced from each other above the second dielectric sheet; and an upper connection pattern connected to the first and second ground patterns.

A circuit board includes at least one circuit board unit sequentially stacked in a thickness direction of the circuit board, an insulating layer, an electromagnetic shielding layer, and a barrier layer. The circuit board unit includes a substrate layer, and two conductive layers respectively disposed on two opposite sides of the substrate layer in a thickness direction of the substrate layer, and each of the conductive layers includes a plurality of signal lines. The insulating layer is located on a side of an outermost conductive layer away from the substrate layer. The electromagnetic shielding layer is located on a side of the insulating layer away from the substrate layer. The barrier layer is located between the electromagnetic shielding layer and the outermost conductive layer. The barrier layer at least covers a plurality of signal lines in the outermost conductive layer.

A wiring board according to the present disclosure includes a core layer including core electrical conductor layers on upper and lower surfaces of a core insulating layer, a first build-up portion, a second build-up portion, a first mounting region, and a second mounting region. The first build-up portion includes a first build-up insulating layer and a first build-up electrical conductor layer connected to the first mounting region. The second build-up portion includes a second build-up insulating layer and a second build-up electrical conductor layer connected to the second mounting region. The second build-up insulating layer includes a margin for adhesion between the second build-up insulating layers or between the second build-up insulating layer and the core insulating layer. The second build-up electrical conductor layer includes an electrical conductor layer for grounding, a first opening, and a signal pad located inside the first opening.