A filter circuit includes: a wiring pattern provided in an upper wiring layer of a printed circuit board, a wiring pattern provided in a lower wiring layer of the printed circuit board, a wiring pattern extending from one end of the wiring pattern, a wiring pattern provided so as to partially face the wiring pattern in the upper wiring layer, a bypass capacitor provided in the upper wiring layer and connected to the wiring pattern and a ground conductor surface, a via connecting one end of the wiring pattern and the wiring pattern, and a via connecting the wiring pattern and the wiring pattern. A structure including the wiring pattern, the via, and the wiring pattern faces a structure including the via and the wiring pattern.

Provided are a circuit board component and a terminal. The circuit board component includes: a circuit board and a wire disposed on the circuit board, where the wire includes a first portion and a second portion, a line width of the first portion is greater than or equal to a line width threshold, and a line width of the second portion is less than the line width threshold.

An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.

A glass core wiring substrate incorporating a high-frequency filter having good high-frequency characteristics as a core material and allowing a more efficient arrangement of a conductor in the glass substrate, a module including the same, and a method of manufacturing the glass core wiring substrate incorporating a high-frequency filter. A conductive layer in a glass through a hole in a glass core substrate has a structure in which a hollow cylindrical conductor layer on a side wall of the glass through hole is connected to a cover conductor layer covering one of two openings of the glass through hole. To achieve such a structure, a carrier is attached to one surface of the glass core substrate to cover one of the openings of the glass through hole, and the carrier is peeled off and removed after lamination of the conductor.

Even when a grounding capacitor is included at either end of a common mode coil, there is noise that flows from a load into a metal frame, and there is a need to restrict an amount of noise propagating to a system power supply. Because of this, a noise loop is formed of a rectifier circuit, an inverter, a first electrical wire that connects a positive polarity side of the rectifier circuit and the inverter, a second electrical wire that connects a negative polarity side of the rectifier circuit and the inverter, a ground wire terminal that can connect a load connected to an output terminal or the inverter, and a conductive plate that connects at least one or the first electrical wire and second electrical wire and the ground wire terminal.

A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelop an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelop a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.

An electrical device (1) is provided, comprising an electrical high-frequency filter (9) and a shield (6) separating the filter from at least one further electrical component (9, 13) of the device, a signal conductor (17) which operably connects the filter (9) to the further component (9, 13) and traverses the shield (6) for transmitting a signal from the filter (9) to the component (9, 13) and a feedthrough capacitor system (19) being electrically arranged between the signal conductor (17) and the shield (6). The feedthrough capacitor system (19) comprises, in particular being formed essentially by, a plurality of surface mount capacitors (41) electrically arranged between the signal conductor (17) and the shield (6), the surface mount capacitors (41) in particular being surface mounted on a circuit board (11), which may be a printed circuit board.

An electronic device is provided that includes a board equipped with a pair of differential transmission lines that each have an opening extending between two line terminals. Moreover, the device includes a capacitor module that includes a support and two capacitors that each have two capacitor terminals, respectively, connected to the two line terminals of one line of the pair of transmission lines. In addition, the support includes a separating region between the two capacitors that has at least one cavity disposed between the two capacitors.

Devices, systems, and methods for serial communication over a galvanically isolated channel are disclosed. A device includes a first IC device interface, first IO components connected to the first IC device interface, a second IC device interface, second IO components connected to the second IC device interface, an insulator layer having a first major surface and a second major surface, at least one pair of capacitor plates and corresponding interconnection paths on the first major surface, and at least one pair of capacitor plates and corresponding interconnection paths on the second major surface, wherein the at least one pair of capacitor plates on the first major surface of the insulator layer are aligned with the at least one pair of capacitor plates on the second major surface of the insulator layer to form at least one pair of capacitors.