In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.

An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.

A high-speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and an opposite second surface. The ground plane layer has a first surface in contact with the second surface of the printed circuit board. The pair of first and second differential traces are on the first surface of the printed circuit board. The first and second differential traces carry an electrical signal. The cascading common mode filter includes an outer and an inner common mode filter. The outer common mode filter includes a U-shaped void section on the first surface of the ground plane layer. The inner common mode filter includes an H-shaped void section on the first surface of the ground plane layer. The H-shaped void section is located proximate to the U-shaped void section.

A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.

A high-speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and an opposite second surface. The ground plane layer has a first surface in contact with the second surface of the printed circuit board. The pair of first and second differential traces are on the first surface of the printed circuit board. The first and second differential traces carry an electrical signal. The cascading common mode filter includes an outer and an inner common mode filter. The outer common mode filter includes a U-shaped void section on the first surface of the ground plane layer. The inner common mode filter includes an H-shaped void section on the first surface of the ground plane layer. The H-shaped void section is located proximate to the U-shaped void section.

[Problem] To achieve a wiring board capable of suppressing the difference in the amount of delay between two signal wirings constituting differential signal wirings, while securing flexibility in design.

[Solution] A wiring board is configured to include a first insulating layer 1, a first signal wiring 2 and a second signal wiring 3. The first insulating layer 1 includes fibers 4 having the long axis in a first direction and aligned approximately parallel to each other at a first interval and an insulating material 5 filling gaps between the fibers 4 of the first direction. The first signal wiring 2 is formed approximately parallel to the first direction on the first insulating layer 1. The second signal wiring 3 is formed parallel to the first signal wiring 2 such that the interval between the first and second signal wirings 2 and 3 be approximately an integral multiple of the first interval, and the second signal wiring 3 transmits a differential signal of a signal transmitted on the first signal wiring 2.

A wiring substrate is a wiring substrate including a plurality of differential pairs. Each of the differential pairs includes a first signal conductor, a first connection portion connected to the first signal conductor via a first via, a second signal conductor, and a second connection portion connected to the second signal conductor via a second via. The first signal conductor and the second signal conductor are arranged on different planes parallel to a bottom surface of the wiring substrate and overlap in a vertical direction. The first connection portion and the second connection portion are arranged on a top surface of the wiring substrate at a predetermined interval in a signal transmission direction. Adjacent differential pairs among the plurality of differential pairs are arranged at a predetermined interval in the signal transmission direction and at a predetermined interval in a direction perpendicular to the signal transmission direction.

A circuit board device includes a multilayer structure, a main ground area and a circuit module. The multilayer structure includes a plurality of plates. The main ground area is arranged in the multilayer structure. The circuit module includes a differential signal circuit and a surrounding circuit module. The differential signal circuit is located in the multilayer structure, and includes a positive signal pad and a negative signal pad. The positive signal pad is located on a configuration surface of one of the plates. The negative signal pad is located on the disposition surface, and is separated from the positive signal pad. The surrounding circuit module is located on the disposition surface, and electrically connected to the main ground area. The surrounding circuit module surrounds the positive signal pad and the negative signal pad in an enclosing way, and is physically separated from the differential signal circuit.

An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.

An electronic device is provided that includes a board equipped with a pair of differential transmission lines that each have an opening extending between two line terminals. Moreover, the device includes a capacitor module that includes a support and two capacitors that each have two capacitor terminals, respectively, connected to the two line terminals of one line of the pair of transmission lines. In addition, the support includes a separating region between the two capacitors that has at least one cavity disposed between the two capacitors.