Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection teiiuinals The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

An electronic apparatus includes a substrate including a first major surface, a second major surface, and an edge surface. The edge surface includes a radius of curvature extending between the first major surface and the second major surface. The electronic apparatus includes an opto-electronic device positioned on the first major surface. The electronic apparatus includes an electrical component positioned on the second major surface. The electronic apparatus includes a first electrically-conductive trace attached to the edge surface. The first electrically-conductive trace electrically connects a first portion of the opto-electronic device to the electrical component and defines a first current path. The electronic apparatus includes a second electrically-conductive trace extending through an opening in the substrate. The second electrically-conductive trace electrically connects a second portion of the opto-electronic device to the electrical component and defines a second current path different than the first current path.

A current sensing device including: an insulating resin substrate; a current sensing element arranged in the resin substrate; a current wire provided via an insulating layer with respect to the current sensing element to flow a current through the current sensing element; a plurality of current vias connecting the current sensing element and the current wire through the insulating layer; and a voltage sensing via connected to the current sensing element to measure a voltage drop.

Glass layers having partially embedded conductive layers for power delivery in semiconductor packages and related methods are disclosed. An example semiconductor package includes a core layer having a thickness between a first surface opposite a second surface. The core layer includes a trench provided in the first surface. The trench partially extending between the first surface and the second surface. An electrically conductive material is positioned in the trench. A trace is provided on the conductive material. The trace is offset in a direction away from the first surface and away from the second surface of the core layer.

Power line patterns are, together with a ground pattern, provided separately from control line patterns. The power line pattern is formed at first and second major surfaces of a circuit board. When the circuit board is viewed in plan view, the power line pattern and the power line pattern form a line structure in which the power line pattern and the power line pattern are in parallel with and opposite to each other and the power line pattern is positioned under the power line pattern. The circuit board includes a dielectric between the power line pattern and the power line pattern. These together form an equivalent capacitor and the magnetic flux induced by the current flowing through the power line pattern and the magnetic flux induced by the current flowing through the power line pattern cancel each other out.

A stretchable circuit board includes a stretchable base material; a stretchable conductive pattern formed on at least one main surface of the stretchable base material and having stretchability; and a reinforcing base having higher rigidity than the stretchable base material, wherein the reinforcing base reinforces the stretchable base material by being directly or indirectly laminated on the stretchable base material so as to surround at least a part of a formation region of the stretchable conductive pattern in the stretchable base material in a plan view.

A circuit board assembly includes a circuit board having at least one conductive inner layer and at least one surface. Contact areas or surfaces and electrical and/or electronic components are disposed on the surface and electrically connected to the contact areas. At least two of the contact areas are connected to one another by an electrically conductive strip having ends each being connected to a respective one of the contact areas. The at least two contact areas and the electrically conductive strip have a width of at least 8 mm and the strip has a thickness that is at least double the thickness of the at least one inner layer.

The invention relates to a method for manufacturing a component (1) comprising a printed circuit board (2) and a number of electrical components (3) arranged thereon. According to the invention, the electrical components (3) are pre-fixed on the printed circuit board (2), which is formed of plastic, by means of a fixing adhesive (9) and then completely encapsulated with an UV-adhesive (8).

A battery management system (BMS) having a printed circuit board (PCB) with a diagonal arrangement for use in a Li-ion battery, a Li-ion battery having a battery management system (BMS) having a printed circuit board (PCB) with a diagonal arrangement, and a BMS having a printed circuit board with diagonal arrangement method.