A power semiconductor module includes a substrate with a metallization layer that is structured. A semiconductor chip having a first side bonded to the metallization layer. A metal clip, which is a strip of metal, has a first planar part bonded to a second side of the semiconductor chip opposite to the first side. The metal clip also has a second planar part bonded to the metallization layer. A mold encapsulation at least partially encloses the substrate and the metal clip. The mold encapsulation has a recess approaching towards the first planar part of the metal clip. The semiconductor chip is completely enclosed by the mold encapsulation, the substrate and the metal clip and the first planar part of the metal clip is at least partially exposed by the recess. A sensor is accommodated in the recess.

A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

A method produces a device adapted to be implanted into the human body for purposes such as neural stimulation, sensing or the like. The method includes: providing a stretchable layer or membrane of an insulating material; forming on the layer or membrane at least one stretchable conductive path; depositing at least one small bolus of a soft and conductive paste or material onto pre-defined areas or portions of the at least one conductive path, and inserting a first end portion of a conductive element 71 into the at least one bolus of soft conductive paste or material. A second end portion of the conductive element opposite to the first end portion is not inserted into the at least one bolus.

Laboratory on chip and its layered manufacturing method, wherein the method includes: designing, by means of a computer program, a printed circuit (7), mixing and reaction cavities (3) of fluids, microchannels (2) and spaces (15) for the placement of electronic components to be found in each layer, mechanizing in one or more biocompatible substrates the different voids and passages that will make up the mixing and reaction cavities (3), microchannels (2), holes (8) that join the microchannels and spaces for the subsequent placement of electronic components (15), metallizing with a biocompatible conductive material those surfaces in which the printed circuit will be integrated (7) according to the design performed in the first step, generating the printed circuit (7) by photolithography and acid attack, bonding the electronic components in the corresponding spaces (15), joining all the layers that make up the final laboratory.

The invention relates to the technical field of heat dissipation, and specifically provides a capillary structure element of a cooling element, wherein the capillary structure is formed by copper metal paste. The copper metal paste includes copper powder, binder, solvent, pore former, dispersant, stabilizer, surfactant, and antioxidant. The present invention also provides a cooling element comprising the capillary structure element and a preparation method thereof. The capillary structure element provided by the invention is arranged with the advantages of simple preparation process, convenient operation, controllable thickness, controllable size and hole diameter, excellent capillary effect and the like, and is especially suitable for preparing ultra-thin cooling elements.

The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.

An electronic device is provided. The electronic device includes a display member including at least one glass, a frame supporting at least a portion of the display member, and a leg member coupled to at least one side of the frame. The leg member includes a first structure, a second structure to be coupled with the first structure, a speaker disposed in a space between the first structure and the second structure, a printed circuit board disposed in the space, and a rib included in at least one of the first structure or the second structure and accommodating the printed circuit board. A rear surface of the speaker may face a resonance space between the first structure and the second structure, and the resonance space may include the space the printed circuit board is disposed in, and may be connected to at least one ventilation hole formed in at least one region of the rib so as to be connected to an outside of the leg member.

Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.

Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

A fluid driving system includes a vibration unit, a piezoelectric element, a signal transmission layer, a plane unit, and a protrusion. The piezoelectric element includes a first electrode and a second electrode electrically isolated from each other. The signal transmission layer includes a first conductive zone and a second conductive zone. The first electrode of the piezoelectric element is electrically connected to the first conductive zone of the signal transmission layer, and the second electrode of the piezoelectric element is electrically connected to the second conductive zone of the signal transmission layer. The plane unit has at least one hole. The piezoelectric element, the signal transmission layer, and the plane unit are located at one side of the vibration unit. The protrusion is located between the vibration unit and the plane unit, and the protrusion corresponds to and protrudes toward the at least one hole.