The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments particularly to form hardware based encryption devices and hardware based encryption equipped communication devices and multi-chip modules such as chiplets. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. The assembly processing may include steps to form hardware based encryption.

Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

An article is described herein which comprises a substrate, a character sequence disposed on the substrate, a scratch-off coating disposed at least in part over at least one portion of the character sequence, and at least one conductive trace disposed at least in part over the at least one portion of the character sequence.

A substrate for a tamper sensor includes a plurality of walls and a tab. The walls define a protective volume with an open side. The walls have a plurality of open edges adjacent the open side and a plurality of interior edges different from the open edges. The tab extends from one of the interior edges of one of the walls and is disposed within the protective volume.

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

A printed board includes a main printed board, and a flexible printed board fixed to the main printed board. The flexible printed board includes a box part formed in a box shape whose main printed board side is opened and a fixed part extended to an outer side and fixed to the main printed board. The flexible printed board is formed with a plurality of tamper detection patterns for detecting at least one of disconnection of the tamper detection pattern itself and a short circuit with other tamper detection pattern. An internal land of the tamper detection pattern is connected with the main printed board and is disposed on an inner side of the box part, an external land of the tamper detection pattern is formed in the fixed part and is fixed to and connected with the main printed board, and the external lands are insulated from each other.

An electronic device and a method for operating an electronic device are provided. The electronic device includes a first circuit board, a second circuit board, a signal line connecting the first circuit board and the second circuit board, a processor disposed on the first circuit board and outputting a pulse signal through the signal line, a parasitic capacitance pattern disposed around the signal line and generating a parasitic capacitance by the pulse signal, and an amplifier disposed on the second circuit board and amplifying a signal generated by the parasitic capacitance, wherein the processor identifies whether the signal line is abnormal, based on the amplified signal obtained from the amplifier.

A printed circuit (PC) card apparatus can, in an absence of external power provided to a Peripheral Component Interconnect Express (PCIe) PC card, prevent and detect unauthorized access to secure data stored on a memory device mounted on the PCIe PC card. The PCIe card includes a primary battery to supply, when external power is disconnected from the PCIe card, power to an electronic security device mounted on the PCIe card. The PC card apparatus also includes a PCIe edge connector protector enclosing electrically conductive fingers of a PCIe edge card connector. The PCIe edge connector protector includes a hidden supplemental charge storage device integrated into the PCIe edge connector protector. The PCIe edge connector protector also includes electrically conductive contacts to transfer supplemental power from the supplemental charge storage device to the electronic security device.

In one aspect, a system component includes a printed circuit (PC) board on which plural conductive ink segments are disposed. The system component also includes a sealed housing that houses the PC board. The plural conductive ink segments define a bit pattern to establish a key.

An object here is to provide a control device which can be reduced in size, weight and cost while being able to prevent unauthorized access. The control device includes: a microcontroller having a storage device, a processor, a package in which the storage device and the processor are accommodated, and multiple communication electrodes provided on a bottom surface of the package; and a wiring board having wiring layers comprised of a front surface layer, an intermediate layer and a rear surface layer, each having a wiring pattern formed therein, insulating members for insulating the respective wiring layers from each other; interlayer connection portions each making an electrical connection between the wiring patterns in different ones of the wiring layers; multiple electrode pads formed n the front surface layer; and communication-dedicated interlayer connection portions which are electrically connected to the respective electrode pads, and which are each externally exposed.