The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments particularly to form hardware based encryption devices and hardware based encryption equipped communication devices and multi-chip modules such as chiplets. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. The assembly processing may include steps to form hardware based encryption.

Disclosed herein are unitary printed circuit boards (PCBs) and methods of using them for testing an integrated circuit (IC). In some embodiments, a unitary PCB comprises a main board portion and a flexible PCB portion, which are configured to be detached from each other at a separation location on the unitary PCB. The main board portion comprises a plurality of pads, and the flexible PCB portion comprises a plurality of through-holes, where a layout of the through-holes corresponds to a layout of the plurality of pads. In some embodiments, a method of testing an IC of a device comprises separating the unitary PBC into a main board portion and a flexible PCB portion, attaching the IC to the main board portion, soldering the main board portion to a platform PCB of the device, and attaching the flexible PCB portion to the main board portion.

In an electrical device, a model series of electrical devices, and a production method, in particular for a converter, having a circuit board including circuit traces, the circuit board has two similar and/or identical contact area arrays, the contact area arrays in particular transitioning into each other through rotation and/or displacement. A first contact area array of the contact area arrays is fitted with a first power module, and the second contact area array is able to be fitted with a second power module, e.g., so that a respective electric motor is able to be supplied from the respective power module.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.

An integrated circuit device includes an integrated circuit device die and a substrate. The integrated circuit device die includes a plurality of first contact pads. The first contact pads include a pair of first signal contact pads configured to provide a differential signal port of the integrated circuit device die. The differential signal port is configured to operate at a predetermined frequency. The substrate includes a plurality of second contact pads on a first surface of the substrate. The second contact pads are configured to be soldered to a printed circuit board, and include a pair of second signal contact pads. The integrated circuit device die is affixed to a second surface of the substrate via the first contact pads. The substrate includes a pair of circuit paths that each couple one of the first signal contact pads to an associated one of the second signal contact pads. The pair of circuit paths each have a length to provide a half-wave matching network at the predetermined frequency to match a single-ended signal at the pair of second signal pads to the differential signal port.

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

Systems and methods for generating a virtual environment for implementing an integrated photonics assembly are presented. An example system can include one or more processors and a memory coupled with the processors, where the processor executes a plurality of modules stored in the memory. The plurality of modules can include a user interface module for deploying one or more virtual photonic integrated subcircuits within the virtual environment, in which the virtual environment is configured to enable coupling of at least two virtual photonic integrated subcircuits. The coupling of the virtual photonic integrated subcircuits can form a virtual integrated photonics assembly. The modules can include a library module comprising a plurality of virtual photonic integrated subcircuits. One or more virtual photonic integrated subcircuits can include a performance characteristic. The performance characteristic can represent a real-world performance characteristic of a pre-fabricated physical photonic integrated subcircuit corresponding to the virtual photonic integrated subcircuit.

According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.

A system board includes at least one microprocessor coupled to the system board. A VR module card includes a voltage regulator circuit, wherein the voltage regulator circuit is configured to provide electrical power to the at least one microprocessor. A circuit board region is configured to receive the VR module card.

The present invention provides a three-dimensional substrate having a different shape than the conventional circuit substrate when a plurality of components are combined to form an electronic circuit. In addition, an electronic device is provided from the three-dimensional substrate. The three-dimensional substrate forms a component forming the three-dimensional structure by three-dimensionally forming the electronic circuit. The component includes at least one electronic component and an electric connection structure for electrically connecting the electronic component with the outside the component. When a plurality of components are combined, the electronic device having the three-dimensional shape having a different shape than the component is formed. The present invention provides the three-dimensional substrate capable of being designed by the shape of the substrate itself.