A polybrominated flame-retardant compound, a process for forming a flame-retardant material, and an article of manufacture are disclosed. The polybrominated flame-retardant compound includes a cyclododecane moiety, at least two bromo groups, and at least one substituent having a reactive functional group. The process includes forming a polybromocyclododecane (PBCD) compound having at least one reactive functional group and incorporating the PBCD compound into a polymer in a process that includes covalent binding of the PBCD compound. The article of manufacture includes a flame-retardant material that comprises a polymer with a covalently-bound PBCD compound.

A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Provided is an epoxy resin composition that has excellent electric characteristics (particularly low dielectric tangent), and that can achieve high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising an active ester compound and an epoxy resin having a specific structure.

The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (), as measured in a prescribed extension-restoration test, are as follows: 20%R95% and 0%3%.

The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

A resin film having an aromatic polysulfone as a forming material is provided. The resin film has a thickness of less than 100 m, and further contains an organic compound having a boiling point no lower than 250 C. and no higher than 400 C. The organic compound is contained in an amount of at least 500 ppm and at most 4000 ppm relative to the mass of the aromatic polysulfone.

A polybrominated flame-retardant compound, a process for forming a flame-retardant material, and an article of manufacture are disclosed. The polybrominated flame-retardant compound includes a cyclododecane moiety, at least two bromo groups, and at least one substituent having a reactive functional group. The process includes forming a polybromocyclododecane (PBCD) compound having at least one reactive functional group and incorporating the PBCD compound into a polymer in a process that includes covalent binding of the PBCD compound. The article of manufacture includes a flame-retardant material that comprises a polymer with a covalently-bound PBCD compound.

A multilayer substrate includes a multilayer body including a plurality of stacked resin layers and a wiring layer provided in the resin layer. The multilayer body includes a deformable flexible portion which generally defines a wave-shaped portion extending in a direction of travel that is repeatedly changed when viewed in a direction of stacking of the resin layers, the wiring layer being routed along the wave-shaped portion. The flexible portion includes a turn-back portion arranged at a position where the direction of travel is changed and an intermediate portion connecting adjacent turn-back portions to each other. A width of the turn-back portion is greater than a width of the intermediate portion.

Disclosed is a vinylbenzyl imide resin useful in conjunction with other components to prepare a resin composition for making such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including resin flow, resin filling property, flame retardancy, glass transition temperature, thermal resistance, dielectric constant, dissipation factor and interlayer bonding strength. Also disclosed is a method of preparing the vinylbenzyl imide resin, its prepolymer, a resin composition comprising the vinylbenzyl imide resin and/or its polymer and an article made therefrom.

Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.