A transformer includes: a magnetic core including a lower magnetic structure and an upper magnetic structure; a printed circuit board arranged between the lower magnetic structure and the upper magnetic structure and including a core hole through which a midsection of the magnetic core penetrates, a primary coil, a secondary coil, a primary via-hole formed at an end of the printed circuit board and electrically connected to the primary coil, and a secondary via-hole formed at another end of the printed circuit board and electrically connected to the secondary coil; a primary pin inserted into the primary via-hole; a secondary pin inserted into the secondary via-hole; an insulating block into which a portion of the printed circuit board is inserted; and a mount on which the printed circuit board and the insulating block are mounted.

A stretchable mounting substrate that includes: a stretchable wiring substrate, the stretchable wiring substrate including a stretchable base material and a stretchable wiring arranged on the stretchable base material; and a module on a surface of the stretchable wiring substrate, the module including a multilayer substrate, a plurality of electronic components on a principal surface of the multilayer substrate, a plurality of first electrodes and a plurality of second electrodes, and internal wirings inside the multilayer substrate. The module has a first electrode arrangement region where the plurality of first electrodes are arranged and a second electrode arrangement region where the plurality of second electrodes are arranged, and includes a node electrode pair, and the internal wiring of the node electrode pair and the stretchable wiring on the stretchable base material intersect each other in plan view of the stretchable wiring substrate.

A circuit board according to the embodiment includes a first substrate including a first insulating layer and a first pad disposed on an upper surface of the first insulating layer; a second substrate including a second insulating layer including a via hole and a metal layer formed on upper and lower surfaces of the second insulating layer and an inner wall of the via hole; a third insulating layer disposed between the first substrate and the second substrate and having a first opening in a region overlapping the via hole; a via filling the via hole and disposed on the first pad exposed through the opening of the third insulating layer; and a second pad disposed on the via and the metal layer disposed on an upper surface of the second insulating layer.

A circuit board according to an embodiment includes an insulating layer including a first via hole; a first via disposed in the first via hole of the insulating layer; wherein the first via includes: a first via part disposed in a first region of the first via hole; and a second via part disposed in a second region other than the first region of the first via hole; wherein the second region is a central region of the first via hole, and the first region is an outer region surrounding the second region; wherein the first via part and the second via part includes: a first surface in contact with each other; and a second surface other than the first surface exposed on the insulating layer; wherein the first surface has a first surface roughness; wherein the second surface has a second surface roughness different from the first surface roughness.

The present disclosure provides a printed circuit board with a plated through hole. The through hole covered by a solder pad at both ends of the through hole. At least two pins are plugged into the through hole, one of which with its head end being thermal contacted with one of the solder pads. Another pin's head end being thermal contacted with the other solder pad. The at least two pins are thermal contacted with one another. Thermal dissipation rate is increased with the structure of the through hole.

An electronic device may include a display module, a connecting member including a bending portion connected to a display panel of the display module and extending toward a rear surface of the display module, and a protective layer formed of an insulating material to cover the bending portion, a printed circuit board disposed on a rear surface of the display module and connected to the display module by the connecting member, a frame disposed to surround at least a portion of the display module and formed of a conductive material, a side member including a first partition wall portion disposed between the frame and the display module to be spaced apart from the frame and a second partition wall portion disposed to be spaced apart from the display module and coveting at least a portion of an outer periphery of the display module.

A connector for use with high-speed signals. The connector may include a row of conductive elements comprising signal conductors and ground conductors. A signal conductor may include a mating end, a mounting end opposite the mating end, and an intermediate portion extending therebetween. A ground conductor may include a shell at least partially encircling intermediate portions of a group of signal conductors, with openings that expose contact surfaces of the signal conductors at the ends. The ground conductors may include contact members aligned with the mating contact surfaces of the signal conductors. Each shell may be coupled to a ground mounting location on each side of a respective group of signal conductors, with adjacent shells sharing a ground mounting location. Such a configuration may meet signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.

A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.

An optical device may include an optical subassembly and a digital signal processor (DSP). The optical device may include a radio frequency (RF) interconnect that electrically connects the optical subassembly and the DSP. The optical device may include a passive RF filter on one or more transmission lines of the RF interconnect.

A PCB that constructs circuit traces, vias, and connection pads by filling recessed areas, grooves, holes, and/or counter bores with conductive material. The recessed areas are filled with conductive ink or plating solutions by a number of methods. Capillary action aids in the filling of the recessed areas. Pressure, vacuum and or gravity can aid the filling. Layers of the PCB or similar type devices can be bonded together both mechanically and electrically to accomplish 3D connections of circuits. Ground and power plane durability and conductivity is enhanced by the inclusion of small grooves over the conductive plane.