A sensor apparatus according to an embodiment of the present technology includes a substrate, one or more first IMU sensors, and one or more second IMU sensors. The substrate has a first surface and a second surface opposite to the first surface. The one or more first IMU sensors are arranged on the first surface. The one or more second IMU sensors are arranged on the second surface. By arranging the IMU sensors on both the first surface and the second surface, it is possible to reduce the size the apparatus and to suppress a deformation of the substrate due to heat. This makes it possible to realize a highly accurate measurement based on a detection result (sensing result) of a plurality of IMU sensors.

A rotary encoder is incorporated in an annular space formed between a hollow rotating shaft and an encoder case. The rotary encoder has an annular printed wiring substrate, a plurality of mounting substrates that are outward from the printed wiring substrate in the radial direction and are arranged in the circumferential direction, and inter-substrate wiring cables bridged between the printed wiring substrate and each of the mounting substrates in the radial direction. Power supply to the mounting substrates and signal transmission and reception between the mounting substrates can be accomplished without routing around the wiring cables. It is possible to achieve a rotary encoder that is suitable for being incorporated in a narrow annular space.

An electronic device, including a first circuit board, a sensing element, a second circuit board, an electronic element, a light emitting element, and a lens, is provided. The first circuit board has a first surface and a second surface opposite to each other and a first side surface located therebetween. The sensing element is disposed on the first surface and electrically connected to the first circuit board. The second circuit board is located on the second surface and electrically connected to the first circuit board. The second circuit board has a third surface facing the first circuit board and a groove recessed in the third surface. The electronic element is disposed on the second surface and located in the groove. The light emitting element is disposed on the first side surface. The lens is disposed on the sensing element. An electronic system, including the electronic device, is also provided.

An electronic device, including a first circuit board, a sensing element, a second circuit board, an electronic element, a light emitting element, and a lens, is provided. The first circuit board has a first surface and a second surface opposite to each other and a first side surface located therebetween. The sensing element is disposed on the first surface and electrically connected to the first circuit board. The second circuit board is located on the second surface and electrically connected to the first circuit board. The second circuit board has a third surface facing the first circuit board and a groove recessed in the third surface. The electronic element is disposed on the second surface and located in the groove. The light emitting element is disposed on the first side surface. The lens is disposed on the sensing element. An electronic system, including the electronic device, is also provided.

An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.

The present disclosure relates to a printed circuit board assembly, which includes: a first printed circuit board, printed with a first transmission trace; a second printed circuit board, printed with a second transmission trace; a substrate, in which, the provides a through aperture for a radio frequency connector; and a radio frequency connector, which includes an inner contact portion, an housing and an insulating part provided between the inner contact portion and housing, where the radio frequency connector is configured to be received in and pass through the through aperture, such that a first end of the inner contact portion of the radio frequency connector is electrically connected to the first transmission trace and a second end thereof is electrically connected to the second transmission trace, so that a first end of the housing of the radio frequency connector is electrically connected to a ground layer of the first printed circuit board and a second end thereof is electrically connected to the ground layer of the second printed circuit board. Thus, the printed circuit board assembly is capable of improving aspects such as shielding effects, PIN performance and/or degree of integration compared with prior art.

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.