Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

An IC unit unloading system including a chute and a drawer. The chute has a plurality of channels each arranged to receive a unit. The drawer is arranged to move along the chute and has a gate with a unit contact face proximate a top surface of the chute. The contact face is arranged to draw the units along the respective channel as the drawer moves along the chute, and to allow the units to slide laterally across the contact face from a first pitch of each channel to a second pitch. A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units so as to project the ball face downwards, then; washing the ball face.

There is provided a component mounter including: a plurality of transport lanes for transporting a board sorted by a board sorting device; a congestion index calculator for calculating a congestion index indicating a congestion degree of each of the plurality of transport lanes; a transport lane determiner for determining a transport lane for carrying in the board among the plurality of transport lanes based on the calculated congestion index; and an outputter for outputting a board request signal for requesting to carry the board into the transport lane determined by the transport lane determiner, to the board sorting device.

A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

A substrate processing system for an electronic device manufacturing system can include a factory interface forming an interior volume, and a partition disposed in the factory interface. The partition can divide the interior volume into a first factory interface chamber forming a second interior volume, and a second factory interface chamber forming a third interior volume. The partition can be configured to provide a first sealed environment in the first factory interface chamber and a second sealed environment in the second factory interface chamber.

The present invention discloses an ejector pin device for chip packaging, which comprises a pin cylinder, a base and an ejector pin base module, wherein the pin cylinder sleeves the ejector pin base module, the base is located below the ejector pin base module and is configured to fix the ejector pin base module; and the ejector pin base module comprises a knob unit and a supporting unit. An effect of adjusting the knob unit can be acted on the corresponding supporting unit, so that the requirements of the numbers and positions of the ejector pins required by different products are satisfied and metal foreign matters are reduced, thereby improving the efficiency of replacing products by a worker.

The invention relates to a support pin (10) for supporting a substrate (80) in a placement area of a placement machine (100) and a placement machine (100) with at least one placement head (101), a magazine (104) with a plurality of such support pins (10) and a placement board (103).

It is an object of the present invention to provide a component management system or the like that can accurately predict component exhaustion in a component mounting device that performs work at a line. Specifying section updates the time table based on the arrival time point or the unloading time point in each of component mounting devices. Arrival predicting section predicts the arrival time point in each component mounting device based on the time table and updates a prediction table. Since component-exhaustion predicting section acquires the arrival time point of a circuit board for which a component will be exhausted from the prediction table and calculates a component exhaustion time point, it is possible to predict the component exhaustion time point with high accuracy. An operator can perform a replenishment work based on the component exhaustion time point.

A substrate tray for accommodating at least one ceramic substrate therein including: an accommodation part including a first opening part of which the upper side is open so that the ceramic substrate can be accommodated and withdrawn; and a support part formed on the circumference of the accommodation part so as to support the side wall circumference of the ceramic substrate, wherein the support part includes: an inner wall in contact with at least one surface of the ceramic substrate; an outer wall spaced a predetermined distance from the inner wall; an upper surface for connecting the inner wall to the outer wall; and a second opening part formed to be open in the direction opposite to the first opening part at a location facing the upper surface between the inner wall and the outer wall.

The present application provides a dispensing apparatus for processing an electronic component, comprising: a first track component and a second track component, a first flow-guiding component and a second flow-guiding component, the first flow-guiding component being arranged at the top of the first track component, the second flow-guiding component being arranged at the top of the second track component, the first flow-guiding component having at least one first gas inlet and at least one first gas outlet in communication with each other, the at least one first gas inlet being configured to be in communication with a clean gas source, the second flow-guiding component having at least one second gas inlet and at least one second gas outlet in communication with each other, the at least one second gas inlet being arranged facing the first gas outlet, and the at least one second gas outlet being configured to be in communication with a gas discharge motive power apparatus, so that clean gas can flow toward the at least one second gas inlet from the at least one first gas outlet, thereby forming a clean gas region above the electronic component to be processed, to avoid contamination with impurities during processing.