A component is disclosed. A component includes an elongated body, with a first end and a second end; and one or more tabs at the first end and the second end, the tabs configured to have a lower tensile strength than other regions of the component.

A pressing device includes a screw body. The screw body includes a screw head that comprises a driver interface. The screw body also includes a screw shaft that comprises a screw tip opposite the screw head with respect to the screw shaft, exterior spiral threads between the screw head and screw tip, and an interior cavity with an opening at the screw tip. The pressing device also includes a pin partially inserted into the interior cavity. The pin comprises a first pin end inserted into the interior cavity, a pin shaft that is connected to the first pin end, and a second pin end that is connected to the pin shaft and that is exterior to the interior cavity. Applying a force to the second pin end in a direction towards the screw head causes the pin shaft to advance into to interior cavity.

A substrate working machine including: a conveyance device configured to convey a substrate; a holding device configured to hold the substrate conveyed to a work position by the conveyance device; and a control device configured to control operation of the conveyance device, wherein the control device is configured to control the operation of the conveyance device such that the substrate is conveyed at a conveyance speed calculated based on a preset setting time and a conveyance distance of the substrate from the work position by the conveyance device or a conveyance distance of the substrate to the work position by the conveyance device.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a material which is moved while being wound and unwound by an uncoiler and a recoiler, and a clamp that is arranged so that a width direction of the material matches a lengthwise direction thereof, and is configured to fix the material, wherein the clamp includes a first clamp and a second clamp formed on opposite ends thereof, and a first-and-second clamp linkage formed between the first and second clamps.

A production management device, which manages a production schedule of a component mounting line, executes a remote operation mode for remotely operating a component mounter to perform a test operation according to an input operation of an operator, in addition to an automatic production mode in which an automated replacement operation of an automated replacement robot is managed according to the production schedule to produce a component mounting board. The production management device determines, when in the remote operation mode, whether a feeder configured to supply components necessary for the test operation is set in the component mounter, and when the feeder that supplies the necessary components is not set in the component mounter, moves the automated replacement robot to the component mounter and sets the feeder configured to supply the necessary components in the component mounter to cause the component mounter to perform the test operation.

Disclosed is a warpage suppressing reflow oven, which comprises a reflow oven body, where a perforated steel plate circulating device comprising a perforated steel plate is disposed at a reflow-oven inner oven. A plurality of downdraft modules is arranged in the perforated steel plate, and the downdraft acting forces thereof face the upper panel. More than one air extractor is communicated with the plurality of downdraft modules via a plurality of pipelines. Under actuation of the air extractors, the downdraft modules generate downdraft acting forces to the bottom surfaces of the products, so that the products are flatly attached to the universal perforated carriers without warpage in a heat soldering process. Thereby, more uniform heating of the products and better contact of solder joints and effectively improving the yield of reflow soldering operations are achieved.

A component mounting system comprising: a stage configured to scatter components; a holding tool configured to move over the stage and hold components from the stage; a storage device configured to store positional information of components on the stage that the holding tool failed to hold; and a control device configured to control the operation of the holding tool so that components are held while excluding components in the positional information stored in the storage device from becoming holding targets.

Provided is a substrate working machine including a holding device configured to hold a substrate in which multiple through-holes are formed, an inserting device configured to insert multiple terminals of a component into the multiple through-holes of the substrate held by the holding device, and an imaging device configured to simultaneously image a shape of a pair of pins and a pair of through-holes of the multiple through-holes, in which positions of the pair of through-holes and the shape of the pair of pins are calculated based on image data captured by the imaging device.

The invention relates to a support pin (10) for supporting a substrate (80) in a placement area of a placement machine (100) and a placement machine (100) with at least one placement head (101), a magazine (104) with a plurality of such support pins (10) and a placement board (103).