A component mounter includes a camera configured to image the supply region, an image processing section configured to execute image processing on image data acquired by imaging of the camera to recognize an accommodation state of the component for each of the multiple cavities and acquire accommodation information in which the accommodation state of the component is associated with a unique address for each of the multiple cavities, and an operation control section configured to execute a collection operation of the component accommodated in the cavity based on the accommodation information.

A clamping assembly for use in a pick and place assembly process includes a fixture and a carrier. The fixture includes at least one retaining feature configured to releasably secure to the carrier such that a part and a substrate are clamped together between the fixture and the carrier.

An electronic device, which includes at least a first part and a second part bonded to each other is provided. The first part includes a first bonding area. The first bonding area includes at least one first testing area. The first testing area includes a plurality of testing pads. The second part includes a second boding area corresponding to the first bonding area. The second bonding area includes a plurality of testing terminals, and includes at least one second testing area respectively corresponding to the at least one first testing area. The second testing area includes a plurality of testing pins. The plurality of testing pads, the plurality of testing terminals and the plurality of testing pins are configured to form a current channel and a voltage testing channel, for measuring a resistance of bonded testing pads and testing pins on both the current channel and the voltage testing channel.

An electronic device, which includes at least a first part and a second part bonded to each other is provided. The first part includes a first bonding area. The first bonding area includes at least one first testing area. The first testing area includes a plurality of testing pads. The second part includes a second boding area corresponding to the first bonding area. The second bonding area includes a plurality of testing terminals, and includes at least one second testing area respectively corresponding to the at least one first testing area. The second testing area includes a plurality of testing pins. The plurality of testing pads, the plurality of testing terminals and the plurality of testing pins are configured to form a current channel and a voltage testing channel, for measuring a resistance of bonded testing pads and testing pins on both the current channel and the voltage testing channel.

Disclosed is a clinch mechanism for assembling a printed circuit board with electronic components that includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.

A clamping assembly for use in a pick and place assembly process includes a fixture and a carrier. The fixture includes at least one retaining feature configured to releasably secure to the carrier such that a part and a substrate are clamped together between the fixture and the carrier.

Systems and methods for reducing displacement of selected components during Printed Circuit Board Assembly (PCBA) manufacturing are described. In some embodiments, a PCBA manufacturing tool may include: a bar having a first end and a second end; a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a PCB; and a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.

A clinch mechanism for assembling a printed circuit board with electronic components includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.

An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

Systems and methods for reducing displacement of selected components during Printed Circuit Board Assembly (PCBA) manufacturing are described. In some embodiments, a PCBA manufacturing tool may include: a bar having a first end and a second end; a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a PCB; and a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.