A component mounting device head unit includes a head main body, a nozzle being provided on the head main body, a drive source, a cover, and a heat transfer member. The nozzle is configured to pick up a component. The drive source is configured to transfer moving power to at least one of the head main body and the nozzle. The cover covers the drive source. The heat transfer member connects the cover to the drive source or a frame of the drive source, and the heat transfer member is configured to allow heat generated by the drive source to escape to the cover.

A shaft drive device includes a plurality of shafts each retained in a raisable and lowerable manner; a return spring for urging each of the shafts upward; an actuating member contactable with a pressed part of any one of the shafts for raising and lowering a selected shaft; and a raising and lowering mechanism which changes a posture of the actuating member between a first posture of coming into contact with the pressed part of the shaft and pressing the pressed part to lower the shaft against an urging force of the return spring and a second posture of releasing the pressing. The pressed part of the shaft is made of ferromagnet, and the actuating member is given a magnetic force.

A mounting head includes a drive part that moves in a vertical direction to apply a load to an electronic component, a float part supported by the drive part in a vertically movable manner, and a linear motor that applies a vertical upward pressing force to the float part. The linear motor includes a stator fixed on the drive part and a moving member fixed on the float part. The drive part moves downward in the vertical direction to apply the load due to own weight of the float part to the electronic component to mount the electronic component onto the board. The linear motor is driven to control a magnitude of the load applied to the electronic component by applying the vertical upward pressing force to the float part.

A linear motor includes: a mover including an output shaft portion extending in a direction of a thrust axis; a detection portion configured to be capable of detecting a position of the output shaft portion in the direction of the thrust axis; and a detected portion fixed to the mover, the mover further includes: a mounting base to which the detected portion is attached; and a metal fastening member that fastens the mounting base to an end surface, on one side in the direction of the thrust axis, of the output shaft portion, and the mounting base includes: a metal fastened portion sandwiched between the end surface, on the one side in the direction of the thrust axis, of the output shaft portion, and the fastening member; and a resin mounting portion having a mounting surface to which the detected portion is attached, the mounting surface being provided at a position off the thrust axis.

A component mounting machine, including a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head.

A linear motion device includes: a base that extends in a reference direction; a linear guide mechanism that includes a guide rail fixed to the base and extending in the reference direction and a slider supported movably on the guide rail along the reference direction; a moving body that is fixed to the slider and that is movable in the reference direction together with the slider; a linear motor that includes a stator fixed to the base, the stator including a magnet row and extending in the reference direction, and a mover including a plurality of coils provided with a certain gap from the stator; and a heat transfer body that is disposed between the moving body and the mover and that is connected to the moving body and the mover, and the heat transfer body extends in a direction away from the linear guide mechanism.

A component supply device including a stage on which electronic components are scattered; a contacting section at a height so as to contact the electronic components on the stage; a slide device to relatively slide the stage and the contacting section; a dropping opening to allow the electronic components scattered on the stage caught by the contacting section to drop in accordance with the relative movement of the stage and the contacting section by the slide device; and a wall at a side opposite to a side of the dropping opening at which the electronic components scattered on the stage drop. The contacting section is provided to extend in a direction perpendicular to a sliding direction by the slide device, and at least a portion of the contacting section is inclined with respect to a straight direction along the sliding direction and an upper surface of the stage.

Provided is an actuator including a shaft, a drive part that moves the shaft, a fixing part disposed around the shaft, the shaft being moved relative to the fixing part, a detecting part that detects a force applied to the shaft on a side closer to the drive part than to the fixing part, and a control device that obtains a first force that is detected by the detecting part in a predetermined period of a period during which the shaft is being moved before the shaft applies the force to a workpiece, and after the predetermined period, controls the drive part based on the force detected by the detecting part and the first force.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes.

A method of mounting components on a PCB includes drawing a component, transporting the component to a starting position, taring the sensor, moving the sensor in Z-axis until the component contacts the board surface, activating the regulator, transmitting from the regulator a signal to a industrial robot as Z-axis offset, releasing the components from the industrial robot if the Z-axis offset is greater than or equal to a preset parameter and establishing the current position of the component as a starting point, moving the component if the Z-axis offset is less than the preset parameter beginning from the current position, arresting movement of the component when the sensor detects an opening edge in the board, moving the component away from the opening edge based on data from the sensor, repeating steps while a change in the component movement is executed.