A method of mounting components on a PCB includes drawing a component, transporting the component to a starting position, taring the sensor, moving the sensor in Z-axis until the component contacts the board surface, activating the regulator, transmitting from the regulator a signal to a industrial robot as Z-axis offset, releasing the components from the industrial robot if the Z-axis offset is greater than or equal to a preset parameter and establishing the current position of the component as a starting point, moving the component if the Z-axis offset is less than the preset parameter beginning from the current position, arresting movement of the component when the sensor detects an opening edge in the board, moving the component away from the opening edge based on data from the sensor, repeating steps while a change in the component movement is executed.

A component placement machine which picks up a component supplied by a tape feeder and installs the component on a board, includes a block part that includes a fitting hole to which a protrusion extending to a rear side from the tape feeder is fitted and a connection member that is provided in the block part, and connects the protrusion to the block part by elastically pressing a side surface of the protrusion fitted to the fitting hole.

A component mounting machine provided with multiple component transfer devices that each have a mourning nozzle, a movable section, and an XY driving mechanism and perform a component mounting operation, and a control device that controls component mounting operation and performs thermal correction processing that reduces influence of thermal deformation accompanying temperature change of at least one of the movable section and the XY driving mechanism, in which the control device has an implementation period determination section that individually determines an implementation period of the thermal correction processing for each of the component transfer devices based on operation circumstances of each component transfer device, and a thermal correction implementation section that simultaneously performs thermal correction processing for the multiple component transfer devices when it is determined that the implementation period of the thermal correction processing is reached for either of the component transfer devices by the implementation period determination section.

A component mounter includes a component transfer device, a tool station, and a control device. The component transfer device is provided with a head main body, and a tool holding device configured to hold a nozzle tool and provided to be raisable and lowerable with respect to the head main body and rotatable around a rotation axis line. The tool station is configured to be able to store an exchange-use nozzle tool at multiple different storage angles. The control device of the component mounter includes an angle acquiring section that acquires the storage angle of the exchange-use nozzle tool in the tool station, and an exchange control section that, during the nozzle tool exchange processing, rotates the tool holding device based on the storage angle of the nozzle tool, and performs angle alignment of the nozzle tool with respect to the head main body.

In a rotary head type component mounter, before using two suction nozzles of rotary head to pick up the leading components in component supply tape set in two tape feeders, rotary head is moved in the XY directions by head moving mechanism and rotated by head rotating mechanism such that the pickup points of the two suction nozzles are positioned on two straight lines and extending in the tape feeding direction of each tape feeder passing through the ideal pickup points of the leading components of the two tape feeders, and the leading components are fed to component pickup positions and that are the pickup points of the suction nozzles on the two straight lines. Then, the two suction nozzles of rotary head are lowered simultaneously to pick up the two component simultaneously using the two suction nozzles.

Tape feeder holding device includes slide section on which a tape feeder can be slid, the tape feeder supplying electronic components by feeding tape housing the electronic components in a tape feeding direction; and sliding device configured to slide the tape feeder held in the slide section in the tape feeding direction, the sliding device being capable of sliding the tape feeder to a supply position at which the electronic components can be supplied from the tape feeder. That is, with the tape feeder holding device, a tape feeder is automatically attached to the tape feeder holding device.

A nozzle managing system in which suction nozzles can be suitably transferred is provided. A nozzle managing machine includes a tray holding section that holds a tray, a palette accommodation device as a nozzle stocker, and a nozzle transfer device that transfers the suction nozzles between the tray and the palette accommodation device. In addition, the nozzle managing machine acquires tray information that is information indicating the tray T held in the tray holding section, acquires nozzle information corresponding to the tray T on the basis of the tray information and JOB information stored in a memory section of a host PC, and controls the nozzle transfer device on the basis of the nozzle information.

An equipment element maintenance management method for managing a maintenance operation for an equipment element that is attached to manufacturing equipment for manufacturing a product includes: acquiring operation history information of the manufacturing equipment at a predetermined timing; analyzing a tendency of a state of the equipment element based on the acquired operation history information; performing the maintenance operation for the equipment element of which the state is worse than a predetermined state; creating maintenance result information which is a result of the maintenance operation; and creating a repair operation instruction for performing an instruction of a repair operation for the equipment element of which the state after the maintenance operation is not more improved than the predetermined state based on the maintenance result information.

A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.

A component mounting method for using a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and which is mounted to be capable of moving between the component supply position and the board, includes determining pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component.