A robot apparatus includes a clamp mechanism; a transport mechanism; and a control unit. The clamp mechanism includes a first finger that has a first support surface and a housing portion and a second finger. The first support surface supports an aligned wire group that includes a plurality of wires, the housing portion includes a guide wall that is connected to the first support surface and regulates an amount of movement of the band member in a width direction. The second finger has a second support surface facing the first support surface and a facing portion being connected to the second support surface and facing the housing portion. The transport mechanism is capable of moving the clamp mechanism. The control unit controls a grip force of the clamp mechanism and a direction of movement of the clamp mechanism by the transport mechanism.

The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

A component mounting apparatus including a component supply device which includes a carrier tape that accommodates a component to be mounted on a board in which a plurality of feeders having carrier tapes loaded are respectively mounted at a plurality of mounting positions, which automatically discharges a carrier tape to a tape insertion port of the feeder based on a component discharge instruction, and which automatically conveys an inserted carrier tape to a suction position at which a component is suctioned when the carrier tape is inserted into the tape insertion port; and control device which instructs discharge or supply of a component.

Provided is an image processing method for easily viewing images obtained by imaging multiple components at a time, the method including image capturing processing of capturing each component holding state relating to multiple suction nozzles mounted on a mounting head as one image, image dividing processing of dividing a region relating to a predetermined component holding state for image data of the multiple component holding states obtained by the image capturing processing, direction conversion processing of converting a direction of the component holding state for divided image data divided by the image dividing processing, and display processing of displaying an image based on the divided image data subjected to the direction conversion processing.

A control device configured to control a component pickup and mounting operation of a component mounting machine; and multiple devices configured to execute the component pickup and mounting operation are provided. A device out of the multiple devices is attachably and detachably attached to the component mounting machine and includes a field programmable gate array that operates each function of the device by communicating with the control device. The field programmable gate array has a clock gating function of reducing an electric current flowing into the attachable and detachable device by stopping processing on a function that is not used, out of individual functions of the attachable and detachable device, when the attachable and detachable device is in a state capable of being removed by an operator.

The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

A drying device includes a recessed portion into which a suction nozzle is inserted, an air jetting port that is formed on a bottom surface of the recessed portion, and a control device that jets air from the jetting port toward a suction nozzle inserted into the recessed portion.

A component supply device including a stage on which electronic components are scattered; a contacting section at a height so as to contact the electronic components on the stage; a slide device to relatively slide the stage and the contacting section; a dropping opening to allow the electronic components scattered on the stage caught by the contacting section to drop in accordance with the relative movement of the stage and the contacting section by the slide device; and a wall at a side opposite to a side of the dropping opening at which the electronic components scattered on the stage drop. The contacting section is provided to extend in a direction perpendicular to a sliding direction by the slide device, and at least a portion of the contacting section is inclined with respect to a straight direction along the sliding direction and an upper surface of the stage.

A carrier tape holding electrical components to a reel around which the carrier tape is wound is provided. Furthermore, the present disclosure is related to a pick-and-place apparatus for receiving this carrier tape and for picking and placing the electrical components arranged in the carrier tape. The carrier tape according to an aspect of the present disclosure includes an adhesive film that forms a bottom wall of the cavities in which a plurality of electrical components is arranged. The adhesive of the adhesive film is configured to substantially release the attachment of the electrical component as a result of heating the adhesive and/or as a result of irradiating the adhesive using light, such as visible light, infrared light, or ultraviolet light, for the purpose of allowing the electrical component to be removed from the cavity using a pick-and-place apparatus.

A holder management device includes a storage device to store a tray that accommodates a component holder and a work machine that performs work using the component holder, a placement section on which the tray is placed, a transfer device to transfer the component holder used in the work machine stored in the storage device in correlation with the tray to the tray placed on the placement section, and a display device to display information indicating a tray to be placed on the placement section together with information indicating a work machine stored in the storage device in correlation with the tray, and in a case where the storage device stores multiple types of trays and work machines in correlation with each other, to display information indicating the multiple types of trays together with information indicating the work machines stored in the storage device.