Transfer material supply units for supplying a transfer material to a transfer table and spreading the transfer material is set in a component mounting machine, and transfer pins for transferring the transfer material to a mounting surface of a three-dimensional board are held by at least one mounting head of the component mounting machine to be exchangeable with a suction nozzle for picking up a circuit component. The lower end of the transfer pin is immersed in the transfer material on the transfer table to attach the transfer material to the lower end of the transfer pin by moving the mounting head holding the transfer pin to a position above the transfer table to lower and raise the transfer pin, and then the transfer material attached to the lower end of the transfer pin is transferred to the mounting surface.

The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

A shaft drive device includes a plurality of shafts each retained in a raisable and lowerable manner; a return spring for urging each of the shafts upward; an actuating member contactable with a pressed part of any one of the shafts for raising and lowering a selected shaft; and a raising and lowering mechanism which changes a posture of the actuating member between a first posture of coming into contact with the pressed part of the shaft and pressing the pressed part to lower the shaft against an urging force of the return spring and a second posture of releasing the pressing. The pressed part of the shaft is made of ferromagnet, and the actuating member is given a magnetic force.

In a component adsorption nozzle, the nozzle can be attached to both of the in-line shaft and the rotary shaft by utilizing the outside (outer wall) of the nozzle body for attaching to the in-line shaft and utilizing the inside (inner wall) of the nozzle body for attaching to the rotary shaft. Therefore, for a user who owns each of the in-line type and rotary type component mounters, it is not necessary to prepare a nozzle dedicated to each type component mounter and it is possible to reduce the burden required for preparing the nozzle.

A component mounting machine includes a head having multiple pickup members, a moving device for moving the head, at least one feeder, and a control device. The feeder is configured to receive correction values for sets of the multiple pickup members, set a target feeding amount for the number of sets based on the received correction values for the number of sets, and sequentially feed components for the number of sets in a predetermined direction with each set target feeding amount. The control device is configured to acquire a positional deviation amount of the multiple pickup members in the predetermined direction for each set, and transmit the correction values for the number of sets based on the acquired positional deviation amount for the number of sets to the feeder so that the feeder collectively receives the correction values for the number of sets at a predetermined timing.

A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to each of the plurality of pipettes for holding a component. The component placement system also includes a positive fluid source for selectively providing a positive fluid pressure for releasing the component from a respective one of the plurality of pipettes.

A method of operating a plurality of machines. Each of the machines uses a servo motor and a motor drive coupled to the servo motor, and the motor drive incorporates a regenerative braking system. The method comprises synchronising the servo motors in order to achieve overlap of the acceleration phases of some machines with the deceleration phases of other machines and providing electrical power from the regenerative braking systems of machines in a deceleration phase to machines in an acceleration phase. A controller for a machine implementing the method, and a system comprising such a controller and a plurality of machines are also disclosed.

A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.