A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

A mounting head includes a drive part that moves in a vertical direction to apply a load to an electronic component, a float part supported by the drive part in a vertically movable manner, and a linear motor that applies a vertical upward pressing force to the float part. The linear motor includes a stator fixed on the drive part and a moving member fixed on the float part. The drive part moves downward in the vertical direction to apply the load due to own weight of the float part to the electronic component to mount the electronic component onto the board. The linear motor is driven to control a magnitude of the load applied to the electronic component by applying the vertical upward pressing force to the float part.

A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.

In a component adsorption nozzle, the nozzle can be attached to both of the in-line shaft and the rotary shaft by utilizing the outside (outer wall) of the nozzle body for attaching to the in-line shaft and utilizing the inside (inner wall) of the nozzle body for attaching to the rotary shaft. Therefore, for a user who owns each of the in-line type and rotary type component mounters, it is not necessary to prepare a nozzle dedicated to each type component mounter and it is possible to reduce the burden required for preparing the nozzle.

A production management device, which manages a production schedule of a component mounting line, executes a remote operation mode for remotely operating a component mounter to perform a test operation according to an input operation of an operator, in addition to an automatic production mode in which an automated replacement operation of an automated replacement robot is managed according to the production schedule to produce a component mounting board. The production management device determines, when in the remote operation mode, whether a feeder configured to supply components necessary for the test operation is set in the component mounter, and when the feeder that supplies the necessary components is not set in the component mounter, moves the automated replacement robot to the component mounter and sets the feeder configured to supply the necessary components in the component mounter to cause the component mounter to perform the test operation.

A component mounting machine includes a head having multiple pickup members, a moving device for moving the head, at least one feeder, and a control device. The feeder is configured to receive correction values for sets of the multiple pickup members, set a target feeding amount for the number of sets based on the received correction values for the number of sets, and sequentially feed components for the number of sets in a predetermined direction with each set target feeding amount. The control device is configured to acquire a positional deviation amount of the multiple pickup members in the predetermined direction for each set, and transmit the correction values for the number of sets based on the acquired positional deviation amount for the number of sets to the feeder so that the feeder collectively receives the correction values for the number of sets at a predetermined timing.

A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to each of the plurality of pipettes for holding a component. The component placement system also includes a positive fluid source for selectively providing a positive fluid pressure for releasing the component from a respective one of the plurality of pipettes.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.