A reel holding device includes a first reel support member that includes a first placement member that rotatably supports a first reel and a second reel support member that supports a second reel. The first reel support member is rotatable between a reference position at which a carrier tape of the first reel is supplied to the mounter, and a discharge position for discharging the first reel. By rotating the first reel support member from the reference position toward the discharge position, the first reel drops through an opening of the first placement member and is discharged. When the first reel support member returns from the discharge position to the reference position, the second reel moves through the opening and into the interior of the first placement member.

A component mounting system includes a mounting machine configured to perform a mounting process of a component on a board by an operation of a unit for the mounting process, an inspector configured to perform an inspection process by using an image of the board after the mounting process and output abnormality information capable of specifying a defective board having an abnormality detected in the inspection process, a camera configured to image the operation of the unit in the mounting machine during the mounting process in a video to store image data in a memory, and a data output section configured to extract image data during the mounting process of the defective board from the memory based on the abnormality information and output the image data to an outside.

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

A mounting head includes a drive part that moves in a vertical direction to apply a load to an electronic component, a float part supported by the drive part in a vertically movable manner, and a linear motor that applies a vertical upward pressing force to the float part. The linear motor includes a stator fixed on the drive part and a moving member fixed on the float part. The drive part moves downward in the vertical direction to apply the load due to own weight of the float part to the electronic component to mount the electronic component onto the board. The linear motor is driven to control a magnitude of the load applied to the electronic component by applying the vertical upward pressing force to the float part.

Embodiments provide for a handheld device with a unified desktop for integrating the functionality of the handheld device with a larger computer system. When connected to a peripheral display and/or a display of the larger computer system, the handheld device provides a unified desktop displayed across the screen(s) of the handheld device and the peripheral display. The unified desktop unifies the functionality provided by the larger computer system and the handheld functionality, e.g., communication applications (e.g., phone, SMS, MMS). A user can seamlessly interact with applications, e.g., open, move, close, receive notifications, on the unified desktop whether the applications are displayed on the screens of the handheld device, or the peripheral display of the larger computer system.

A linear motion device includes: a base that extends in a reference direction; a linear guide mechanism that includes a guide rail fixed to the base and extending in the reference direction and a slider supported movably on the guide rail along the reference direction; a moving body that is fixed to the slider and that is movable in the reference direction together with the slider; a linear motor that includes a stator fixed to the base, the stator including a magnet row and extending in the reference direction, and a mover including a plurality of coils provided with a certain gap from the stator; and a heat transfer body that is disposed between the moving body and the mover and that is connected to the moving body and the mover, and the heat transfer body extends in a direction away from the linear guide mechanism.

In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.

The image data generation device includes a component information input section and an image data generation section. The component information input section is configured to input a mounting position and an outer shape of the electronic component for each of the multiple electronic components to be mounted in the mounting processing. The mounting position includes a position in a height direction orthogonal to a surface of the board. The image data generation section is configured to generate image data for displaying a state when each of the multiple electronic components to be mounted in the mounting processing is arranged at the mounting position of the electronic component based on the mounting position and the outer shape of the electronic component input by the component information input section.

A motor includes: a rotating shaft; a motor portion; a circuit board; a case having a circuit housing recess portion for housing the circuit board; and a cover made of a synthetic resin and sealing the opening portion of the circuit housing recess portion. The cover has an outer circumference rib and an inside rib. The outer circumference rib is located on the outer circumferential side from the opening end surface of the circuit housing recess portion and projects from the outer circumferential edge of the cover toward the front surface side of the cover and the rear surface side of the cover. The inside rib is located inside from the opening end surface and projects at least either on the front surface side of the cover or on the rear surface side of the cover.