The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.

Component mounting line includes multiple component mounting machines arranged along a conveyance direction of a board, feeder storage container that stores multiple feeders that are attachable and detachable to component mounting machine, and exchanging robot capable of exchanging feeder between feeder storage container and each of the component mounting machines, in which feeder storage container is installed in the same arrangement as the multiple component mounting machines, and exchanging robot moves along the conveyance direction of the board and exchanges feeder. Accordingly, regardless of which of the component mounting machines feeder is used in, replenishment and collection may be performed in feeder storage container, so that an operator can easily replenish and collect feeder.

A board work machine includes a board holding portion configured to hold a board, a work head configured to hold a lead component having a lead wire and insert the lead wire into a through-hole formed in the board, a lead wire cutting device configured to cut the lead wire inserted into the board by relatively reciprocally moving a first blade portion and a second blade portion, a distortion sensor configured to detect distortion of at least one of the first blade portion or the second blade portion, and a control device configured to drive the lead wire cutting device to acquire a value from the distortion sensor when the lead wire is not inserted into the board.

A cut and clinch unit is provided with pair of slide bodies, and each slide body is configured from movable section and fixed section that slidably holds the movable section. An insertion hole is formed in the movable section. A pair of leads of a leaded component are inserted into the insertion holes of a pair of slide bodies, and the pair of leads are bent into an N shape by each movable section being slid. The cut and clinch unit is movable in the XY directions by operation of a moving device. Also, the distance between the pair of slide bodies can be changed freely. Accordingly, it is possible to mount leads at any position on a board in a state bent into an N shape, and to mount leaded components with various different lead separation distances on a board in a state bent into an N shape.

A lead component mounting method includes: a component insertion process in which two lead wires are inserted into two corresponding through-holes which are formed in a circuit board from one side of the circuit board in a state in which at least a pair of pawl portions pinches and holds each of the two lead wires which are included in a lead component; and a clinching process in which protruding portions, which are portions protruding from another side of the circuit board, of the two lead wires which are inserted into the two corresponding through-holes, are bent in a state in which the two lead wires are held by at least the pair of pawl portions.

There is provided a tape feeder for supplying, using a taped electric component including a carrier tape and multiple electric components held onto the carrier tape, the electric component in a supply position, the tape feeder including a detection sensor configured to detect presence or absence of the electric component in the supply position.

In a component insertion machine for inserting a component with a lead into a board, when the lead is cut by lead cutting device having a fixed blade 60 and a movable blade prior to insertion, the component is moved to a position where the lead approaches or contacts the fixed blade, at which position the movable blade is operated to cut the lead.

A board work system including: a conveying and holding device including a pair of rails configured to support a board, and a changing mechanism configured to change a distance between the pair of rails, the conveying and holding device being configured to convey the board supported by the rails and hold the board at a work position; a work device configured to perform work with respect to the board held by the conveying and holding device from an underside of the board; a moving device configured to move the work device; and a control device, the control device including an acquiring section configured to acquire a rail spacing distance that is the distance between the pair of rails, and an operation control section configured to control operation of the moving device based on the rail spacing distance acquired by the acquiring section.

A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.