An electronic component transferring apparatus is configured to transfer an electronic component on a flexible carrier onto a target substrate. The electronic component transferring apparatus includes a first frame configured to carry the flexible carrier, a second frame configured to carry the target substrate, an abutting component arranged adjacent to the flexible carrier, an actuating mechanism, an energy generating device, and an optical sensing module. The actuating mechanism is configured to actuate the abutting component and move the abutting component in a direction of the flexible carrier, such that an abutting end of the abutting component abuts against the flexible carrier. The energy generating device is configured to generate an energy beam penetrating at least a portion of the abutting component and being directed towards the flexible carrier from the abutting end of the abutting component. The optical sensing module is configured to perform sensing through the abutting component.

An electronic component transfer apparatus is configured to transfer an electronic component on a flexible carrier to a target substrate. The electronic component transfer apparatus includes a first frame, a second frame, an abutting component, an actuating mechanism, an energy generating device, an image capture device, and a data processing module. The first frame is configured to carry the flexible carrier. The second frame is configured to carry the target substrate. The abutting component is disposed adjacent to the flexible carrier. The actuating mechanism is configured to actuate the abutting component, so that the abutting end of the abutting component abuts against the flexible carrier. The energy generating device generates an energy beam. The image capture device captures an image through the abutting component. The data processing module receives and computes the image to determine whether to adjust the relative position between the abutting end and the flexible carrier.

Templates to arrange and/or align components for batch placement on a substrate are described. A batch placement template can include a number of detents physically arranged relative to each other corresponding to a physical arrangement of components to be placed on a substrate. The detents can be sized to allow components to be manipulated into the detents and subsequently picked and placed on the substrate in a batch process.

An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

A method is provided for aligning micro light-emitting diodes. A platform is provided with arrays. Each of the arrays includes grooves. The platform is used to receive magnetic micro light-emitting diodes. Magnetic attraction and vibration are alternately exerted on the platform to cause the magnetic micro light-emitting diodes to fall into the grooves in a correct orientation. It is determined whether the magnetic micro light-emitting diodes fill the platform. Mass transfer is executed if the magnetic micro light-emitting diodes fill the platform.

According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.

The invention relates to a method of preparing a setup kit for at least one placement machine, wherein the placement machine serves for the placement of components on/at assemblies, and wherein those components that are required for the assemblies for a plurality of different assemblies to be manufactured are determined by means of the placement machine; possible setup kits for the placement machine are prepared iteratively from the determined components, with each setup kit comprising a plurality of components; an optimized setup kit is selected from the setup kits
by means of an electronic processing device in the method,

An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

An electronic component transfer apparatus is configured to transfer an electronic component on a flexible carrier to a target substrate. The electronic component transfer apparatus includes a first frame, a second frame, an abutting component, an actuating mechanism, an energy generating device, an image capture device, and a data processing module. The first frame is configured to carry the flexible carrier. The second frame is configured to carry the target substrate. The abutting component is disposed adjacent to the flexible carrier. The actuating mechanism is configured to actuate the abutting component, so that the abutting end of the abutting component abuts against the flexible carrier. The energy generating device generates an energy beam. The image capture device captures an image through the abutting component. The data processing module receives and computes the image to determine whether to adjust the relative position between the abutting end and the flexible carrier.