A pre-calibrated spray plane image acquisition device is described that includes, in a single fixed-form structure, both an image capture component configured to acquire an optical image of a field of view and a light plane generator configured to generate a planar light plane emitted from the pre-calibrated spray plane image acquisition device. A carrier frame structure includes rigid components for permanently maintaining the image capture component and the light plane generator in respective positions defining a permanent spatial relationship between the field of view of the image capture component and the light plane generated by the light plane generator.

A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

There is described a method of assessing an ink deposition accuracy in an electronic device printing process. The method generally has: printing a meta material structure on a substrate using conductive ink, the metamaterial structure having a pattern of conductive elements interspersed with complementary insulating elements, the metamaterial structure having at least a terahertz resonance frequency; emitting a terahertz radiation beam incident on the metamaterial structure of the substrate, the incident terahertz radiation beam having power at least at the terahertz resonance frequency of the metamaterial structure; the metamaterial structure interacting with said incident terahertz radiation beam resulting in an outgoing terahertz radiation beam having a spectral response at least at the terahertz resonance frequency; measuring said spectral response of said outgoing terahertz radiation beam; assessing an ink deposition accuracy of said printing based on said measured spectral response; and generating a signal based on said assessed ink deposition accuracy.

A component supply device, including a stage on which components are scattered; an imaging device configured to image components scattered on the stage; a storage device configured to store first identification information capable of identifying a first component which is a component scheduled to be supplied from the stage and second identification information capable of identifying a second component which is a component not scheduled to be supplied from the stage; and a determination device configured to determine whether the first component is present on the stage based on the first identification information and imaging data from the imaging device, and to determine whether the second component is present on the stage based on the second identification information and imaging data from the imaging device.

The substrate processing management system for a substrate processing line including a defect tallying section to calculate a defect rate representing a rate of occurrence of substrates or electronic components determined to be defective with the substrate inspection machine, or obtain a number of defective products having substrates or electronic components determined to be defective; an attribute change recognition section to recognize when an attribute, among the attributes of the electronic component, having a possibility of affecting the inspection, has changed in the component mounting machine; a fault point estimation section to estimate, when the defect rate or the number of defective products exceeds a predetermined value, which of the component mounting machine or the substrate inspection machine is a fault point depending on whether an attribute has changed; and a countermeasure calling section configured to call for a defect countermeasure to the estimated fault point.

A component supply device includes a plurality of kinds of tape feeders capable of mounting a first component storing tape by which supplying of components is performed precedingly, and a second component storing tape by which supplying of components is performed succeedingly; a component sensor configured to detect runout of the components in the first component storing tape; and a control unit configured to control a tape feeding operation. A specified discharge length by which the first component storing tape is discharged at the time of occurrence of the runout of the components is preliminarily set for each kind of the tape feeder. The control unit is configured to make the tape feeder perform a tape feeding operation for feeding the first component storing tape by the specified discharge length when the component sensor detects the runout of the components in the first component storing tape.

A component mounting system comprising: a stage configured to scatter components; a holding tool configured to move over the stage and hold components from the stage; a storage device configured to store positional information of components on the stage that the holding tool failed to hold; and a control device configured to control the operation of the holding tool so that components are held while excluding components in the positional information stored in the storage device from becoming holding targets.

The data management system includes a first storage section storing registration data in which component specifying information for specifying a component is associated with shape data, a second storage section storing possession device data, a search section for searching the registration data from the first storage section by using partial information included in at least one of the shape data and the component specifying information as a search condition, and a determination section for performing a suitability determination process of determining whether the shape data included in the registration data in a search result by the search section is suitable for the mounting process using the configuration device, based on the possession device data.

Data associated with an electronics component within a placement process performed by a placement machine is recorded by using the camera to image a machine-readable code located on the component tape which expresses data associated with an electronics component to be picked up by the placement head. The camera could be located within the feeder or the placement head.

A feeder operation inspection device includes an image processing section configured to deduce a position of a brightness change point group, which is a set of brightness change points where an amount of change in brightness relative to a periphery in an image datum is equal to or larger than a specified value, for each of multiple image data, a calculating section configured to calculate an actual conveyance amount of a carrier tape which is actually conveyed through a conveyance process based on the position of the brightness change point group of each of the multiple image data, and a determination section configured to determine whether the feeder operates normally in the conveyance process based on a designated conveyance amount and an actual conveyance amount in the conveyance process.