A computer-implemented method of automated X-ray inspection during the production of printed circuit board, PCB, assemblies. The method includes capturing an X-ray image of a PCB assembly, determining a first error indicator based on image processing of the captured X-ray image, determining, in case the first error indicator indicates the PCB assembly as faulty, a second error indicator based on the captured X-ray image using a trained adaptive algorithm, and outputting the second error indicator as a result of the inspection.

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

Various embodiments of the teachings herein include a device for detecting process parameters during a pass through an assembly line for assembling electronic components and/or for applying joining materials. The device may include: a carrier for transport by a conveying system of the assembly line and configured to receive a test plate; a sensor for measuring a process parameter during the pass; and a force sensor arranged to detect a force acting on the test plate during the pass.

A tape erroneous mounting detection system includes sensors provided to the plurality of tape feeders, a reader configured to read identification information from a recording part which is provided to a reel, and a memory part configured to store part verification information. The tape erroneous mounting detection system also includes a part verification part configured to determine whether or not the tape is mounted on the tape feeder at the set position, and to perform verification updating processing, and a tape erroneous mounting detection part configured to perform erroneous mounting detection processing where the tape erroneous mounting detection part identifies the tape feeder on which the tape is mounted based on the tape presence or absence information and the output from the sensor, and the tape erroneous mounting detection part detects that the tape mounted on the tape feeder is erroneously mounted.

In the measurement device, electrical characteristics of a component can be measured adequately even if the component size is small. In the measurement device, at least a part of the component holding section is an antistatic section made of an antistatic material. Since the surface resistance of the antistatic section is large, it is possible to measure the electrical characteristics of a component in a state where the component is held by the antistatic section. Therefore, even if the size of the component is small, scattering of the component is prevented and the electrical characteristics can be adequately measured.

A component mounting machine includes an imaging device configured to image a supply position, to which a component is supplied from a component supply device, from above, a component detecting sensor configured to detect the component. A control device acquires component information related to the component supplied by the component supply device when a predetermined determination condition is established. Then the control device selects from multiple processing including first determination processing for determining presence or absence of a component shortage of the component supply device by determining presence or absence of the component at the supply position based on a captured image, and second determination processing for determining presence or absence of a component shortage of the component supply device by detecting the presence or absence of the component at the supply position by the component detecting sensor.

A method for detecting errors or malfunctions in electrical or electronic components of circuits, wherein each of the circuits is located on a circuit board and wherein a plurality of circuit boards border one another on a circuit board panel, includes populating each of the circuit boards of the circuit board panel with electrical or electronic components corresponding to the circuits; for each of the analog, electrical or electronic components used for the construction of the circuits, placing a corresponding test component in an edge region of the circuit board panel; providing the analog, electrical or electronic test components placed in the edge region of the circuit board panel with test points; and checking for the correct function value and/or the correct poling of the analog, electrical or electronic test components provided with test points and located in the edge region of the circuit board panel.

In an electrical characteristic acquisition apparatus, a condition under which an electrical characteristic of a target object is acquired can be inputted by an operator, and an electrical characteristic of the target object is acquired under the input condition. In a case where a condition is inputted as a condition under which an electrical characteristic of the target object is acquired, an erroneous determination is made due to the different conditions that the target object is not an electrical component which complies with the nominal value, or, in a case where a difference between a value representing an electrical characteristic of the target object and a nominal value of the target object is larger than a permissible tolerance, an erroneous determination is made that the target object is defective. Here, these erroneous determinations are prevented from being made.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to each of the plurality of pipettes for holding a component. The component placement system also includes a positive fluid source for selectively providing a positive fluid pressure for releasing the component from a respective one of the plurality of pipettes.