An optical communication equipment performs optical communication between a first apparatus and a second apparatus. The optical communication equipment includes a monitoring section configured to monitor a light amount during optical communication, and a control device configured to output predetermined information when the light amount is less than a first threshold value and shut off communication between the first and second apparatuses when the light amount is less than a second threshold value lower than the first threshold value.

The control device of a tape feeder, during the loading processing, in a case in which carrier tape that is preadjusted such that a length from a first cavity, which houses the electronic component and which is first from the leading end of the carrier tape among the multiple cavities, to the leading end of the carrier tape is a regulated length is inserted into the insertion section, starts conveyance of the carrier tape and makes a position of the first cavity a specified position in the feeder main body in accordance with a detection result of the detection sensor.

A CPU box of each mounting machine module obtains MAC addresses of communication devices of both an internal device and a base by communicating with the communication devices of both the internal device and the base after the power is turned on, compares the obtained MAC address of the internal device side and the obtained MAC address of the base side, with storage data of the MAC addresses of both the internal device side and the base side read from a non-volatile storage medium of the CPU box, obtains management data of the mounting machine module stored in association with the MAC address of the internal device side from the non-volatile storage medium of a management computer in a case where the MAC address of the internal device side does not match the storage data, and obtains the management data of the mounting machine module stored in association with the MAC address of the base side from the non-volatile storage medium of the management computer in a case where the MAC address of the base side does not match the storage data.

A component mounting apparatus including a component supply device which includes a carrier tape that accommodates a component to be mounted on a board in which a plurality of feeders having carrier tapes loaded are respectively mounted at a plurality of mounting positions, which automatically discharges a carrier tape to a tape insertion port of the feeder based on a component discharge instruction, and which automatically conveys an inserted carrier tape to a suction position at which a component is suctioned when the carrier tape is inserted into the tape insertion port; and control device which instructs discharge or supply of a component.

A substrate manufacturing machine (component mounter) includes a substrate type setting section configured to set next and subsequent substrate types to be manufactured subsequently to a current substrate type currently being manufactured, a substrate type checking section configured to check whether the set next and subsequent substrate types are correct, a manufacturing condition investigation section configured to examine whether a manufacturing condition for manufacturing substrates of the next and subsequent substrate types is satisfied, and a manufacturing authorization section configured to authorize manufacturing of the substrates of the next and subsequent substrate types in a case where the next and subsequent substrate types are correct and the manufacturing condition is satisfied.

The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

A component mounting system includes a mounting machine configured to perform a mounting process of a component on a board by an operation of a unit for the mounting process, an inspector configured to perform an inspection process by using an image of the board after the mounting process and output abnormality information capable of specifying a defective board having an abnormality detected in the inspection process, a camera configured to image the operation of the unit in the mounting machine during the mounting process in a video to store image data in a memory, and a data output section configured to extract image data during the mounting process of the defective board from the memory based on the abnormality information and output the image data to an outside.

It is an object of the present invention to provide a production system and a control method for the production system that can suppress erroneous mounting when a tape feeder is shared and used even when latest tape feeder information is not shared among multiple production lines in a production system having multiple production lines. Information that matches the tape feeder database stored by the line management device is stored in the tape feeder. When the tape feeder is mounted on the mounting machine, the information stored in the tape feeder is read, and when it is determined that the information does not match the tape feeder database, mounting of the electronic component supplied from the tape feeder is stopped.

A mounting device comprises: a mounting head having multiple pickup members configured to pick up components; a mounting control section configured to cause a second component to be picked up later when a first component, held by the mounting head at a predetermined height, and the second component, held by the mounting head at a lowered position lower than the predetermined height, are picked up with the mounting head; the mounting control section being configured to cause the second component to be released earlier when the mounting head, having picked up the first component and the second component, releases a component.

A control device configured to control a component pickup and mounting operation of a component mounting machine; and multiple devices configured to execute the component pickup and mounting operation are provided. A device out of the multiple devices is attachably and detachably attached to the component mounting machine and includes a field programmable gate array that operates each function of the device by communicating with the control device. The field programmable gate array has a clock gating function of reducing an electric current flowing into the attachable and detachable device by stopping processing on a function that is not used, out of individual functions of the attachable and detachable device, when the attachable and detachable device is in a state capable of being removed by an operator.