A power control system includes electronic component mounting apparatuses; power control modules configured to control power of the electronic component mounting apparatuses; a power controller configured to turn on and off the power of the electronic component mounting apparatuses by controlling the power control modules, or receive signals from the power control modules indicating power on and off states of the electronic component mounting apparatuses; and a remote control module that is remote from the electronic component mounting apparatuses and is configured to control the power of electronic component mounting apparatuses by controlling the power controller via a wired or wireless connection.

A control device configured to control a component pickup and mounting operation of a component mounting machine; and multiple devices configured to execute the component pickup and mounting operation are provided. A device out of the multiple devices is attachably and detachably attached to the component mounting machine and includes a field programmable gate array that operates each function of the device by communicating with the control device. The field programmable gate array has a clock gating function of reducing an electric current flowing into the attachable and detachable device by stopping processing on a function that is not used, out of individual functions of the attachable and detachable device, when the attachable and detachable device is in a state capable of being removed by an operator.

The disclosure discloses an array substrate, a display panel, and a display device. A first power signal line is configured to be formed by electrically connecting a first signal line located in a first source-drain metal layer and a second signal line located in a second source-drain metal layer through a via hole, which is equivalent to that the first power signal line is composed of the first signal line and the second signal line connected in parallel, and the equivalent resistance of the parallel-connected first signal line and second signal line included in the first power signal line is smaller than the resistance of any of the signal lines. Thus, the resistance of the first power signal line may be effectively reduced, so that an IR drop of a display panel with an array substrate may be reduced, and the display uniformity of the display panel is improved.

An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module provides a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to whether the load device is connected to the Ethernet power supply.

In a board work system, the CPU of a board work device transmits error related information which relates to an error in a case where the error has occurred in the own device. Then, the CPU receives the error related information which relates to the error of the other board work device, and stores the received error related information in the HDD. Then, the display operation section is controlled such that information (other device error notification screen) based on the stored error related information is notified to the operator in a case where the power source of the board work device (other board work device), in which the error has occurred, is detected to be switched off.

A pick-and-place spindle module comprises: a modular body structure including a first receiving location configured to receive a spindle; a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis; a first theta motor configured to rotate a spindle received in the receiving location; a first motion control chip each attached to the body structure, the first motion control chip configured to control the first z-axis motor and the first theta motor; and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank.

A component mounting machine performs a mounting operation of mounting an electronic component to a board. The component mounting machine includes: multiple related operation devices each including an electrically-operated section configured to perform a related operation that is an operation related to the mounting operation, and an output section configured to output an operation signal representing a state of the electrically-operated section that is operating; and circuitry configured to limit the quantity of the related operation devices for which the electrically-operated section is in an operating state to a specified quantity or fewer based on whether there is presence of the operation signal of the multiple related operation devices.

A spindle for a pick-and-place machine includes a shaft including a length extending between a first end and a second end, the shaft including an outer body and a hollow interior, a nozzle tip disposed at the first end of the shaft, the nozzle tip configured to contact an electronic component for manipulation of the electronic component, and a theta gear disposed on the shaft, the theta gear configured to engage with a motor of a pick-and-place head. The spindle is configured to be removably attachable from the pick-and-place head. A dispensing head spindle module, spindle bank and assembly machine incorporating the spindle are disclosed.

A method of assembly comprising a pick-and-place spindle module having a modular body structure including a first receiving location configured to receive a spindle, a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis, a first theta motor configured to rotate a spindle received in the receiving location, an air distribution system including an air distribution port, the air distribution system configured to deliver received air from the air distribution port to a spindle received in the first receiving location, an electrical distribution system including an electrical distribution port, and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank such that the air distribution port is connected to receive air from the spindle bank and the electrical distribution port is configured to receive electricity from the spindle bank.

A method of assembly comprising a spindle bank for a pick-and-pace machine, a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.