A component mounting machine includes a base material device to convey a circuit base material, a component mounting device to mount an electronic component, an imaging device to capture a predetermined region including the circuit base material, a first detection section to detect at least one device mark provided on the base material device and at least one base material mark provided on the circuit base material, a calculation section to calculate a position on the circuit base material where the electronic component is to be mounted, based on the device mark and the base material mark detected by the first detection section, and a feedback section configured to feed back, as a correction value for correcting a position on the circuit base material to be calculated next by the calculation section, a part of the deviation amount detected by a second detection section.

A component mounting machine provided with multiple component transfer devices that each have a mourning nozzle, a movable section, and an XY driving mechanism and perform a component mounting operation, and a control device that controls component mounting operation and performs thermal correction processing that reduces influence of thermal deformation accompanying temperature change of at least one of the movable section and the XY driving mechanism, in which the control device has an implementation period determination section that individually determines an implementation period of the thermal correction processing for each of the component transfer devices based on operation circumstances of each component transfer device, and a thermal correction implementation section that simultaneously performs thermal correction processing for the multiple component transfer devices when it is determined that the implementation period of the thermal correction processing is reached for either of the component transfer devices by the implementation period determination section.

A component mounting machine includes a tool station and a determination section. The tool station detachably accommodates a holding member including a main body section which can hold a component to be mounted on a board and multiple identification sections which can identify multiple accommodation angles. The determination section determines an angle difference in which the accommodation angle of the holding member differs from a predetermined accommodation angle. At least one identification section of the multiple identification sections is defined as a first identification section, the at least one identification section being exposed when the accommodation angle of the holding member is the predetermined accommodation angle in a close state in which the multiple identification sections are partially covered by a shielding member. When the determination section cannot recognize the first identification section in the close state, the determination section attempts to recognize a second identification section.

In a work machine which includes a working head including a lifting and lowering unit including a working device and a first lifting and lowering device which lifts and lowers the working device, and a second lifting and lowering device which lifts and lowers the lifting and lowering unit, a positional deviation (Δx, Δy) of the working device in a direction which is perpendicular to a lifting and lowering direction is eliminated. Since the positional deviation is caused by both an inclination of a lifting and lowering axis line L.sub.1 of the working device by the first lifting and lowering device and an inclination of a lifting and lowering axis line L.sub.2 of the lifting and lowering unit by the second lifting and lowering device, based on positional deviation data a target moving position is corrected.

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

An electronic component mounting device including a component holding device to hold and mount on a board an electronic component supplied by a component supply device; a motor to drive the component holding device; a motor control device to control the motor; a load measurement device to measure a load applied from the component holding device upon being pressed by the component holding device while the component holding device performs the same operation as when mounting an electronic component on a board, by replacing the board with the load measurement device; a motor information acquisition section to obtain motor information corresponding to the force with which the motor drives the component holding device in the pressing direction against the load measurement device while the motor control device performs the same operation as when mounting an electronic component on the board, by replacing the board with the load measurement device.

The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

An articulated robot includes an arm, an actuator, a storage device, and a control device. The storage device stores the correction parameter for correction accuracy required for each of the multiple work regions, which are segmented as the regions in which work on the work target object is performed in the movable region of the robot arm. When the work is instructed with designation of the target position, the control device acquires, from the storage device, a correction parameter corresponding to a work region to which the designated target position belongs, among the multiple work regions. Then, the control device controls the actuator by correcting the target position using the acquired correction parameter.

An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section.