A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

A tray-type component supply device includes an exchanging table configured to lift and lowered between an upper position and a lower position, a conveyance section configured to receive a tray from the exchanging table and convey the tray, and a control section configured to receive a detection signal from the detection sensor and cause the driving section to operate the exchanging table, the control section including an abnormality detecting section configured to detect an abnormal state in which a height position of the exchanging table becomes unidentified, a retraction operating section configured to cause the exchanging table to move to the retraction position at a low speed when the abnormal state is detected, and a calibration and restoration section configured to calibrate the height position of the exchanging table to restore a normal state.

A positioning control device, in which motion of a motor in positioning operation of causing a mechanical load connected to the motor to move by a target moving distance is specified by operational conditions and command parameters, includes an adjustment unit performing the positioning operation based on an adjustment condition and a trial parameter, which are an operational condition and a command parameter, and determining one of the command parameters to be an excellent parameter corresponding to the adjustment condition based on an evaluation result based on the state of the motor or the mechanical load during positioning operation performed; and an estimation unit determining one of the command parameters to be an estimated excellent parameter corresponding to a non-adjustment condition, which is one type of the operational conditions, based on an adjustment record being a pair of the adjustment condition and the excellent parameter corresponding to the adjustment condition.

A component mounting device that performs mounting processing for mounting a component on a board based on a production program, includes: a storage section configured to store information; a setting section configured to set a correction value related to a mounting position of the component included in the production program; a storage control section configured to make the storage section store date and time information on which calibration related to the mounting processing is executed when the calibration is executed, and to make the storage section store the correction value in association with latest date and time information of the calibration when the correction value is set; and a correction section configured to perform a correction related to the mounting position using the correction value corresponding to the latest date and time information of the calibration without using the correction value not corresponding to the latest date and time information.

A mounting accuracy measurement chip includes a chip main body; and one or more protrusions provided on a mounting face of the chip main body, which serve as a contact surface with a mounting target at a position shifted from the mounting face of the chip main body. The one or more protrusions are disposed only within a range defined by a circle whose center is center of gravity of the mounting face and whose radius is half the length of the longest distance from center of gravity to the outer edge of chip main body. Further, a mounting accuracy measurement kit includes the above-mentioned mounting accuracy measurement chip and placement portion, having a degree of adhesiveness, to which the contact surface of mounting accuracy measurement chip, which can be placed, adheres.

An angle sensor of a tape feeder includes a magnetic body that rotates in conjunction with the rotation of a sprocket, a magnetic sensor that outputs a detection signal corresponding to the angle of the magnetic body with respect to the feeder main body, and an angle calculating section that performs offset processing for adjusting an origin of the detection signal using a preset offset value, gain processing that adjusts the magnitude of the detection signal using a preset gain value, and that calculates the angle of the magnetic body based on the adjusted detection signal. The control device performs correction processing for correcting at least one of the offset value or the gain value based on the detected signals outputted from the magnetic sensor.

A component mounting machine, including a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head.

A malfunction determining device includes a head including a pickup member for picking up a component, a moving device configured to move the head, an inspection section, a determining section, and a notification section. The inspection section executes multiple inspections including a first inspection for performing a mounting operation under control of the head and the moving device to inspect whether the mounting operation is good or bad, and a second inspection for performing a calibration measurement of the head to inspect whether the calibration measurement is good or bad. The determining section determines presence or absence of a malfunction and a malfunction location in the head and the moving device based on a combination of results of the multiple inspections.

A mounting machine management system in which a management server, a terminal device, and a mounting machine are connected via a communication network such that communication is possible. The management server is provided with an authorization ID transmitting device configured to transmit an authorization ID that allows operation required for adjustment of the mounting machine to the terminal device and the mounting machine. The mounting machine is provided with an authorization ID acquiring device configured to acquire the authorization ID that the terminal device received from the management server, and an operation permitting device configured to allow the operation required for adjustment of the mounting machine in a case in which the authorization ID acquired by the authorization ID acquiring device matches the authorization ID that the mounting machine received from the management server.

The operator may first place a blank device in a first socket in a first site. The APS may self-teach the position and orientation of that first socket by removing and replacing the device in the socket one or more times, and by detecting the position of the device in the socket or by monitoring a change in position of the device as it is placed into the socket. The APS then picks the device from the first socket (or from the input tray) and moves it in succession through the rest of the sockets to establish position and orientation of each socket. After all sockets are taught, the APS loads all sockets with blank devices, and programming begins. Alternatively, the programming job begins as each site is taught and before the remaining sites are taught so that production output can begin “immediately.”