A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.

A multilayer board includes thermoplastic resin layers laminated together, a first-class conductor pattern including a conductor foil on a first surface of one of the thermoplastic resin layers, a second-class conductor pattern in contact with a second surface of the one of the thermoplastic resin layers, and an interlayer connection conductor in the one of the thermoplastic resin layers and including a first end surface connected to the first-class conductor pattern and a second end surface connected to a second-class conductor pattern. The second-class conductor pattern and the first interlayer connection conductor include a conductor of a single material including a resin, or a conductor of a single material including a metal with a melting point lower than that of the conductor foil.

The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).

A substrate for a printed wiring board, the substrate includes a base film containing polyimide as a main component and a sinter layer disposed on at least a portion of a surface of the base film and containing copper nanoparticles. The base film contains a nitrogen atom bonded to a copper atom of the copper nanoparticles, an average number of the nitrogen atom bonded to the copper atom per unit area of the surface of the base film on which the sinter layer is disposed is 2.6×10.sup.18 atoms/m.sup.2 to 7.7×10.sup.18 atoms/m.sup.2, and the average number is an average number calculated for a measurement region estimated to have a thickness of 3 nm from a measurement value of the surface of the base film measured by X-ray photoelectron spectroscopy.

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.

Provided according to an exemplary embodiment is a heater for an aerosol generation device, the heater comprising a plurality of segments combined together to form an insertion portion into which an object-to-be-heated is inserted; one or more electrically conductive tracks printed on one surface of each of the plurality of segments and disposed toward the object-to-be-heated; and an elastic member configured to surround at least a part of the plurality of segments.

The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

This disclosure discloses a flexible printed circuit, a chip on film, and a bonding method and a display device using this flexible printed circuit and chip on film. The flexible printed circuit/chip on film of this disclosure a humidity detection layer located between a flexible base film and a metal foil, wherein the humidity detection layer and the flexible base film, and/or the humidity detection layer and the metal foil, are optionally bonded by an adhesive layer. The humidity detection layer can change resistance and/or color according to the humidity, so that intuitive and rapid localization of coating badness is performed directly (by color change) or by means of a detecting lead and an impedance/voltage detecting circuit, and finally the object of reducing the ratio of defective products is achieved.

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.

The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.