The capillary transfer technology presented here represents a powerful approach to transfer soft films from surface of liquid onto a solid substrate in a fast and defect-free manner. The fundamental theoretical model and transfer criteria validated with comprehensive experiments and finite element analyses, for the first time provides a quantitative guide and optimization for the choice of material systems, operating conditions and environments for scalable on-demand transfers with high yield. The intrinsically moderate capillary transfer force and externally selectable transfer direction offer robust capabilities for achieving deterministic assembly and surface properties of structures with complex layouts and patterns for potentially broad applications in the fabrication of flexible/stretchable electronics, surface wetting structures and optical devices. Integration of this technology with other advanced manufacturing technologies associated with material self-assembly, growth and layout alignment represents promising future topics and would help create emerging new manufacturing technologies that leverage unique fluidity of liquid environments.

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

An object of the present invention is to provide a light- or heat-curing method by which a cured product (crosslinked product or resin) can be prepared in a simple method even in a case where filler is contained in a large amount; a curable resin composition which is used in the curing method; and the like. The present invention provides a light- or heat-curing method containing a step 1 of obtaining (E) a condensate having constitutional units of Si—O—Al and/or Si—O—Si, obtained from aluminum derived from an aluminum alkoxide and a silane derived from a silane coupling agent having a mercapto group, from (A) a compound that is formed of a salt of a carboxylic acid and an amine and has a carbonyl group generating a radical and a carboxylate group generating a base through decarboxylation by irradiation with light or heating, the (B) aluminum alkoxide, the (C) silane coupling agent having a mercapto group, and (D) water, and a step 2 of performing a reaction among the (E) condensate, (H) a compound having two or more polymerizable unsaturated groups, and (I) filler under the conditions of irradiation with light or heating in the presence of the (A) compound; a curable resin composition which is used in the curing method; and the like.

A wiring circuit board includes a porous insulating layer, and a first conductive layer sequentially toward one side in the thickness direction. The first conductive layer includes a first signal wire and first ground wires. Each of the first ground wires is thicker than the first signal wire.

The elastomeric electrode includes: a stretchable substrate 10 having wrinkles formed on one surface thereof, the peaks C and valleys T of the wrinkles being repeated; a wrinkled metal nanoparticle layer 20 including metal nanoparticles 21 and formed by deposition of the metal nanoparticles along the wrinkles of the substrate 10; and a wrinkled monomolecular layer 30 including a monomolecular material having one or more amine groups (—NH.sub.2) and formed by deposition of the monomolecular material onto the metal nanoparticle layer 20. Also disclosed is a method for preparing the elastomeric electrode.

A electronic component including a first protective layer covering the substrate and the conductive tract, a second protective layer covering at least a portion of the first protective layer, wherein the second protective layer includes Parylene, and a third protective layer covering at least a portion of the second protective layer.

An extensible and contractible wiring board includes first and second extensible and contractible wiring substrates formed by respective wiring at extensible and contractible substrates. Each of the first and second extensible and contractible wiring substrates has a first end having functional units and an intermediate wiring portion, with the wiring and the functional units of the first and second extensible and contractible wiring substrates not electrically connected. Moreover, the first and second extensible and contractible wiring substrates are electrically independent extensible and contractible wiring substrates, and the wirings and the functional units do not overlap at the first ends of the first and second extensible and contractible wiring substrates in top view of the extensible and contractible wiring board, and the intermediate wiring portions of the first and second extensible and contractible wiring substrates overlap in top view of the extensible and contractible wiring board.

A method electrically insulates an electronic device including a housing having a first face provided with a first opening closed by a PCB and a second face provided with a second opening extending facing at least a portion of at least one connection interface in which at least one first connector is connected. The method includes the steps of forming a mold around the connection interface, and while the device is placed in a vacuum enclosure, pouring a liquid resin into the mold in order to form a layer of electrically insulating material between the connector and the connection interface. A device is obtained by performing the method.

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.