Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The lower electrode layer includes a first metal layer positioned on a side facing the dielectric layer and a second metal layer positioned on a side facing away from the dielectric layer. The first metal layer has a first surface positioned on a side facing the second metal layer and a second surface positioned on a side facing the dielectric layer. The first surface has a surface roughness higher than that of the second surface. The second metal layer reflects a surface property of the first surface.

A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

An object of the present invention is to provide a laminated sheet for a metal-clad laminate and a method of manufacturing the same, the laminated sheet including: a substrate that includes a liquid crystal polymer or a fluoropolymer; and an adhesive layer, in which adhesiveness with a metal layer formed on the adhesive layer is excellent. Another object of the present invention is to provide a metal-clad laminate and a method of manufacturing the same.

A laminated sheet for a metal-clad laminate includes: a substrate that includes a liquid crystal polymer or a fluoropolymer; an inorganic oxide layer; and an adhesive layer, in which the substrate, the inorganic oxide layer, and the adhesive layer are laminated in this order.

A circuit board according to the present disclosure includes a substrate that is composed of a ceramic(s), and an electrically conductive layer that is positioned in contact with the substrate. The substrate includes a groove around the electrically conductive layer. Furthermore, an electronic device according to the present disclosure includes a circuit board with a configuration as described above, and an electronic component that is positioned on the electrically conductive layer.

A device includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

A method includes steps of forming an inner coating on an object and forming an outer coating in contact with the inner coating. A first solution including metal oxide nanoparticles and a first solvent is applied onto the object. The first solvent is removed to form the inner coating with the metal oxide nanoparticles. A second solution having silicon dioxide nanoparticles and a second solvent is applied onto the object. The second solvent is removed to form the outer coating with the silicon dioxide nanoparticles. The interfacial binding force between the metal oxide nanoparticles and the silicon dioxide nanoparticles is then strengthened, for example, by applying a third solution such as water, ethanol or a mixture thereof to the inner coating and the outer coating.

A wiring board includes an insulating layer; an insulating oxide film that is formed by forming a film of metal oxide or semimetal oxide on a surface of the insulating layer; a seed layer that is made of metal and that is stacked on the insulating oxide film; and an electrode that is made of metal and that is formed on the seed layer, wherein the insulating oxide film and the seed layer are removed from an area not overlapping the electrode to expose the insulating layer.

A composite structure for use as a constituent of a mounting device, wherein the composite structure comprises an electrically conductive carrier, an intermediate layer comprising adhesion promoting material and being arranged on the electrically conductive carrier, and a thermally conductive and electrically insulating layer on the intermediate layer.

A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.