An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

Provided is a novel resin composition for a metal-clad laminate, with which a metal-clad laminate having excellent adhesion with a metal foil, solder heat resistance, insulation and the like can be produced. A terminally modified polybutadiene contained in the resin composition for a metal-clad laminate according to the present invention has a structure of formula (III) on each of both terminals of a polybutadiene comprising a repeating unit of formula (I) and a repeating unit of formula (II), wherein a proportion of the repeating unit of formula (I) in all the repeating units is 70 to 99% by mol.

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An electrode or wiring, an electrode pair, and a method for manufacturing the electrode or wiring. The electrode or wiring includes: particles of a layered material including one or more layers; and metal particles or a sintered metal. The one or plural layers include a layer body represented by M.sub.mX.sub.n, wherein M is at least one metal belonging to group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1-4, and m is greater than n and at most 5, and a modification or terminal T (T being at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) is present on the surface of the layer body.

A flexible circuit board includes liquid crystal polymer (LCP) layers and metal layers including circuit routes. Each of the LCP layers includes via structures. The metal layers and the LCP layers are alternatively stacked to form a multi-layer structure. Adjacent metal layers are electrically connected through the via structures. Some via structures of different LCP layers are substantially aligned with one another to form a stack of via structures. Each of the via structures includes openings filled with conductive material. The size of the opening fulfils the following equation: Vb≥cos(Bh/Vh)*Vt/k*2, where Vb is a diameter of a smaller aperture, Vt is a diameter of a bigger aperture, Vh is a combined thickness of a LCP layer and a metal layer, Bh is a thickness of a LCP layer and k is a tensile modulus.

An inductor component includes a main body formed in a flat-plate shape and including a magnetic layer; an inductor wiring line disposed on a plane inside the main body; a first vertical wiring line that extends, from a pad portion which is an end portion of the inductor wiring line, in a first direction to pass through the inside of the main body, and is exposed on a first principal surface side of the main body; a second vertical wiring line that extends, from the pad portion of the inductor wiring line, in a second direction to pass through the inside of the main body, and is exposed on a second principal surface side of the main body; and an insulation layer of a non-magnetic body. The first vertical wiring line includes a via conductor and a columnar wiring line. The second vertical wiring line includes a columnar wiring line.

A method for manufacturing a functionally graded composite material for a printed circuit board (PCB) is proposed. The method may include preparing two or more types of mixed powders with different contents of polymer or ceramic powder, each mixed powder comprising (i) a metal powder comprising a powder made of aluminum or an aluminum alloy and a powder of magnesium and (ii) the polymer or ceramic powder. The method may also include laminating the two or more types of mixed powders to form a functionally graded laminate in which a ratio of the content of the polymer or ceramic powder to the content of the metal powder in each of layers stacked in sequence from bottom to the top of the laminate differs. The method may further include preparing a functionally graded composite material by sintering the functionally graded laminate by pressureless sintering or spark plasma sintering.

A printed circuit board, on which at least one light emitting diode including at least two electrodes is mounted, includes a base member, an insulating layer disposed on the base member, a plurality of conductive pads disposed on the insulating layer and electrically connected to the light emitting diode, a plurality of via holes formed through at least one conductive pad of the plurality of conductive pads and at least a portion of each insulating layer, and filling members disposed in the plurality of via holes to electrically connect the base member to the at least one conductive pad, A distance between the plurality of via holes is ‘n’ times greater than a depth of at least one via hole of the plurality of via holes, in which ‘n’ is a positive integer greater than ‘1’ and less than ‘10’.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

A wiring board includes an insulating base including a first principal surface, a second principal surface opposite to the first principal surface, and a first through hole penetrating the insulating base from the first principal surface to the second principal surface, a functional material provided inside the first through hole, a first insulating layer covering the first principal surface, and a first surface of the functional material, and a second insulating layer covering the second principal surface, and a second surface of functional material. A second through hole is formed in the first insulating layer, the functional material, and the second insulating layer, and a conductive layer is formed on a wall surface of the second through hole.

A anisotropic conductive film includes: an electrically insulating adhesive layer; electrically conductive particles disposed in lattice form in the electrically insulating adhesive layer; a reference electrically conductive particle defined, an electrically conductive particle closest to the reference electrically conductive particle defined as a first electrically conductive particle, an electrically conductive particle equally close or next closest to the reference electrically conductive particle regarding the first electrically conductive particle defined as a second electrically conductive particle. The second electrically conductive particle absent from lattice form axis including the reference electrically conductive particle and first electrically conductive particle. A projection image in the anisotropic conductive film longitudinal direction of the reference electrically conductive particle and first electrically conductive particle or second electrically conductive particle overlap and the anisotropic conductive film projection image in a short-side direction the reference electrically conductive particle and second electrically conductive particle or first electrically conductive particle overlap.