Graphene ink compositions comprising nitrocellulose and related methods of use comprising either thermal or photonic annealing.

An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.

An electrode or wiring, an electrode pair, and a method for manufacturing the electrode or wiring. The electrode or wiring includes: particles of a layered material including one or more layers; and metal particles or a sintered metal. The one or plural layers include a layer body represented by M.sub.mX.sub.n, wherein M is at least one metal belonging to group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1-4, and m is greater than n and at most 5, and a modification or terminal T (T being at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) is present on the surface of the layer body.

An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.

Water-based nanoparticle inks may be formulated to be compatible with printed electronic direct-write methods. The water-based nanoparticle inks may include a functional material (nanoparticle) in combination with an appropriate solvent system. A method may include dispersing nanoparticles in a solvent and printing a circuit in an aerosol jet process or plasma jet process.

In an embodiment the dielectric layer comprises a fluoropolymer, a plurality of boron nitride particles, a plurality of titanium dioxide particles, a plurality of silica particles; and a reinforcing layer. The dielectric layer can comprise at least one of 20 to 45 volume percent of the fluoropolymer, 15 to 35 volume percent of the plurality of boron nitride particles, 1 to 32 volume percent of the plurality of titanium dioxide particles, 10 to 35 volume percent of the plurality of silica particles, and 5 to 15 volume percent of the reinforcing layer; wherein the volume percent values are based on a total volume of the dielectric layer.

Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300° C. or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25° C. being 1.0×10.sup.3 to 2×10.sup.5 mPa.Math.s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.

A flowable, (e.g., screen printable, stencil printable and/or dispensable) thermally conductive paste is disclosed and provide low temperature curing or firing. The pastes are useful in forming thermally conductive pathways for electronic type applications, such as, providing thermal conduction between a semiconductor chip and its associate semiconductor chip packaging (e.g. power electronic applications), which can be useful in power converters, electrical power steering modules, car head lights (LEDs), solar cells, printed circuit boards (PCBs), plasma display panels (PDPs), and the like. The pastes have a combination of conductive flakes and particles in a minimal amount of carrier fluid and carrier resin to provide advantageous deposition and heat melding properties.

A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets, and methods of, and apparatus for, forming the same. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a complex (3D) conductive trace is formed using two or more different print technologies via creation of different domains within the conductive trace pattern.