A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.

A composite with hollow nano-structures includes multiple one dimensional hollow nanowires being dispersed into a polymer film. The polymer film is flexible, a dielectric constant of the one dimensional hollow nanowire is lower than a dielectric constant of the polymer film, and a dielectric constant of the composite is between the dielectric constant of the one dimensional hollow nanowire and the dielectric constant of the polymer film.

[Problem to be solved]

Provided is an electronic component having thermal insulation properties and insulation resistance, which can be suitably used for modularization by injection molding or the like.

[Means to Solve the Problem]

There is provided an electronic component comprising a circuit board on which an electronic element is mounted and a coating layer for coating the surface of the circuit board, wherein the coating layer comprises at least a thermoplastic resin and hollow particles; and the coating layer has a concentration gradient of hollow particles in the thickness direction such that the content of the hollow particles in the coating layer is lower on the face side in contact with the circuit board.

A method of direct printing or writing of a metallic material involves depositing, with a printing device or writing device, an ink comprising of at least undercooled liquid metallic particles dispersed in a carrier fluid. The ink is deposited on any substrate surface to deposit the undercooled liquid metal particles thereon as one or more layers that can form a desired pattern or layered structure.

A ceramic electronic component that includes a plurality of ceramic layers which are stacked together, and an internal conductor layer disposed between two adjacent ceramic layers among the plurality of ceramic layers, and in which a ceramic layer that is adjacent to the internal conductor layer includes a plurality of pores.

Resin compositions including (A) a hollow organic polymer particle, (B) an epoxy resin, and (C) a curing agent provide cured products having a superior smear removal properties.

A prepreg is a blend of a fiber reinforcement, a matrix resin and a filler. Based on 100 parts by mass of the prepreg, the fiber reinforcement is 20-60 parts by mass, the matrix resin is 20-65 parts by mass, and the filler is 10-40 parts by mass. The filler is a flame-retardant organic microsphere or a blend of the flame-retardant organic microsphere and an inorganic filler, and the particle size of the filler is preferably 0.1 microns to 15 microns. A copper-clad laminate and a printed circuit board are also disclosed. In various embodiments, the stability of material properties of the prepreg can be improved, the prepreg manufacturing process is simplified, the prepreg production efficiency is improved. Due to the high production efficiency of the prepreg, the manufacturing cost of the prepreg, the copper-clad laminate and the printed circuit board can be reduced.

The application relates to a transparent conductive film (1) according to one embodiment, wherein the first transparent layer (31) having a first pattern of first electrodes is provided, e.g. deposited, on the first side (2a) of a transparent base film (2) and the second transparent layer (32) having a second pattern of second electrodes is provided, e.g. deposited, on the second side (2b) of the transparent base film (2). Further, the application relates to a method for producing a transparent conductive film. Further, the application relates to a touch sensing device and to different uses.

A method of direct printing or writing of a metallic material involves depositing, with a printing device or writing device, an ink comprising of at least undercooled liquid metallic particles dispersed in a carrier fluid. The ink is deposited on any substrate surface to deposit the undercooled liquid metal particles thereon as one or more layers that can form a desired pattern or layered structure.

A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.