Provided is a novel resin composition for a metal-clad laminate, with which a metal-clad laminate having excellent adhesion with a metal foil, solder heat resistance, insulation and the like can be produced. A terminally modified polybutadiene contained in the resin composition for a metal-clad laminate according to the present invention has a structure of formula (III) on each of both terminals of a polybutadiene comprising a repeating unit of formula (I) and a repeating unit of formula (II), wherein a proportion of the repeating unit of formula (I) in all the repeating units is 70 to 99% by mol.

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A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290° C. is less than 20% of a percentage weight loss of the paper from room temperature to 900° C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10° C./min.

The invention relates to an element in the shape of a sensor, an active electronic component, a switch, a circuit, or an electric conducting path for integration into a surrounding medium. The element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate. The openings of the substrate are open in an area of the circuit trace. The use and manufacture of the element are also provided.

A process for manufacturing an electrically conducting device from lignocellulosic material comprises the following steps: impregnating (S10) the lignocellulosic material with at least one filling compound so as to produce a composite substrate; and depositing (S12) at least one conducting layer on at least one surface of the composite substrate so as to produce an electrically conducting device.
Use of an electrically conducting device so produced for example particularly as a touch interface.

In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.

An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.

A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.

A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20 C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.

In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.

A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290 C. is less than 20% of a percentage weight loss of the paper from room temperature to 900 C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10 C./min.