An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).

An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for olidifying the thermosetting material (TSM1) and forming an electrical connection (E).

A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer.

This application discloses a printed circuit board, a battery module, a battery pack, and an electrical device. The printed circuit board may include: a substrate, a pad, a solder paste layer, a component body, and a support assembly. The pad may be disposed above the substrate. The solder paste layer may be disposed above the pad. The component body may be disposed above the solder paste layer. The support assembly may be disposed between the pad and the component body to form a degassing space between the component body and the solder paste layer.

To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

A method for manufacturing an electromagnetic shielding film comprising providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer; and painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer. The conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.