A circuit board assembly includes a first circuit board, a second circuit board having a first side extending adjacent to a first side of the first circuit board, and a metal fitting including a portion bent at the angle and spanning both the first side of the first circuit board and the first side of the second circuit board. The second circuit board is in a posture having an angle other than 180° to the first circuit board. The metal fitting is fixed to both the first circuit board and the second circuit board.

An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

Provided is a power conversion device which comprises a main circuit board, a first board, and a second board and which has a reduced size. The main circuit board has a rectifier circuit and an inverter circuit which are disposed in a high-power section, the rectifier circuit rectifying AC voltage and The second board is provided with a The first board is connected to the main circuit board and to the second board, and is provided with: a first circuit disposed in a low-power section. The second board is provided with a second circuit disposed in a low-power section. section from each other in a reinforced manner; an insulating transformer disposed in the reinforced insulation region and constituting a constituent component of a power supply circuit for receiving the DC voltage and supplying power to the first circuit and to the second circuit; and an insulating element disposed in the reinforced insulation region and allowing a signal to be exchanged between the first circuit and the second circuit.

An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface.

An electrical connector includes a housing holding wafer assemblies in a wafer stack each including a wafer body holding a leadframe with signal contacts arranged in pairs and extending between mating ends and mounting ends. Each pair includes a primary signal contact and a secondary signal contact. Each signal contact has a main body extending through the wafer bodies and a mating end extend from the wafer body presented at the mating interface. The mating ends are twisted 45° relative to the main bodies. The mating end of the primary signal contact is arranged at a first side of the main body and the mating end of the secondary signal contact is arranged at a second side of the main body to define a twisted pair interface configured to be mated with the mating signal contacts of the mating electrical connector.

Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

A connector gap between a module connector mating surface and the backplane connector of a chassis may be eliminated through a mechanism that forcefully pushes (or pulls) the module towards the backplane and/or forcefully pushes (or pulls) the backplane toward the module. A spring-loaded or resilient element may be used to fasten the module in a way that effectively fills any designed-in and tolerance-induced gap in the connector interface, allowing the connector to fully seat. In addition, a gasket or other compressible member may be included at the connector mating interface. The gap in the connector interface may be reduced by introducing adjustable card cage members that are capable of being set during the assembly or manufacturing process using special alignment fixtures. The gap in the connector interface may also be reduced by introducing a higher tolerance capable manufacturing process, such as machining, to the card cage sub-assembly.

A method of manufacturing a printed circuit board (PCB) includes determining a weft direction of the PCB, and defining a routing design of differential pairs. The routing design is designed to have a fixed region in the weft direction. The method further includes manufacturing the PCB according to the routing design.