Embodiments presented in this disclosure generally relate to techniques for interconnecting integrated circuits. More specifically, embodiments disclosed herein provide a back mounted interposer (BMI) to facilitate interconnecting of integrated circuits. One example apparatus includes an integrated circuit, an interposer, and a circuit board, at least a portion of the circuit board being disposed between the integrated circuit and the interposer, where the circuit board is configured to provide electrical connection between the interposer and the integrated circuit via connection elements on a first surface of the interposer. The apparatus also includes an interface on a second surface of the interposer, the interface being configured to provide signals from the integrated circuit to an electrical component.

In an electrical device, a model series of electrical devices, and a production method, in particular for a converter, having a circuit board including circuit traces, the circuit board has two similar and/or identical contact area arrays, the contact area arrays in particular transitioning into each other through rotation and/or displacement. A first contact area array of the contact area arrays is fitted with a first power module, and the second contact area array is able to be fitted with a second power module, e.g., so that a respective electric motor is able to be supplied from the respective power module.

The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.

An electronic module includes a first wiring board, a second wiring board, and an intermediate connection member. The intermediate connection member includes an insulator, a plurality of first wirings supported by the insulator and arranged at intervals in a second direction intersecting a first direction, a plurality of second wirings supported by the insulator and arranged at intervals in the second direction, and a metal layer supported by the insulator and interposed between the plurality of first wirings and the plurality of second wirings so as to oppose the plurality of first wirings and the plurality of second wirings in a third direction intersecting the first direction and the second direction. A part of the metal layer sandwiched in the insulator is bonded to one of the first wiring board or the second wiring board by a conductive first bonding member.

A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.

A display panel includes an array substrate, a first flexible circuit board, a non-flexible circuit board, a control circuit board and a second flexible circuit board; the first flexible circuit board is electrically connected to the array substrate; the non-flexible circuit board is electrically connected to the first flexible circuit board; the control circuit board is provided on the non-flexible circuit board and is electrically connected with the non-flexible circuit board; the second flexible circuit board is electrically connected to the non-flexible circuit board.

Semiconductor light emitting device includes: substrate including main and back surfaces, first and second side surfaces, and bottom and top surfaces, wherein main surface includes first to fourth sides; first main surface electrode on main surface and including first base portion contacting the sides of the main surface, and die pad connected to first base portion; second main surface electrode disposed on the main surface and including second base portion contacting first and third sides of the main surface, and wire pad connected to second base portion; semiconductor light emitting element including first electrode pad and mounted on die pad; wire connecting first electrode pad and wire pad; first insulating film covering portion between first base portion and die pad; second insulating film covering portion between second base portion and wire pad and having end portions contacting main surface; and light-transmitting sealing resin.

An adapter board is described having a substrate having a width, a length and a depth and at least one electrical component placed one of within the substrate and on a surface of the substrate. The adapter board may also have a first pad positioned on the substrate, the first pad connected to the at least one electrical component through a first via. The adapter board may also have a second pad positioned on the substrate, the second pad connected to the at least one electrical component through a second via, wherein at least a portion of the adapter board is configured through an additive manufacturing process and wherein the substrate is configured to be installed within a downhole tool.

A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the pair of board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A solder layer is provided between the electronic element and the interposer board, joins the electronic element with the interposer board, and includes a solder unfilled region.