To improve a TCT characteristic of a circuit substrate. The circuit substrate comprises a ceramic substrate including a first and second surfaces, and first and second metal plates respectively bonded to the first and second surfaces via first and second bonding layers. A three-point bending strength of the ceramic substrate is 500 MPa or more. At least one of L1/H1 of a first protruding portion of the first bonding layer and L2/H2 of a second protruding portion of the second bonding layer is 0.5 or more and 3.0 or less. At least one of an average value of first Vickers hardnesses of 10 places of the first protruding portion and an average value of second Vickers hardnesses of 10 places of the second protruding portion is 250 or less.

A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one electrically insulating layer structure has at least partly tapering through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. In addition, different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.

An electronic circuit includes an upper substrate and a lower substrate. An electronic integrated circuit chip is positioned between the upper and lower substrates. The chip includes contact elements coupled to the upper substrate. A first region made of a first material is arranged between the chip and a heat transfer area crossing the lower substrate. A second region filled with a second material couples the lower and upper substrates and laterally surrounds the first region. The first material has a thermal conductivity greater than a thermal conductivity of the second material.

Systems and methods for detecting an incorrectly attached heat sink component on an electronic device. The system includes one or more temperature sensors secured to the electronic device and a controller unit comprising one or more processors and one or more computer-readable media, the computer-readable media having stored thereon executable instructions that are executable by the one or more processors to perform a method for detecting incorrectly attached heat sink components. The method includes receiving temperature data, calculating a thermal ramp rate, comparing the thermal ramp rate to a predetermined threshold ramp rate, and transmitting a fault signal when the calculated thermal ramp rate exceeds the predetermined threshold ramp rate.

Provided is a method for manufacturing a composite body, the method including: a nitriding step of firing a boron carbide powder in a nitrogen atmosphere to obtain a fired product containing boron carbonitride; a sintering step of molding and heating a blend containing the fired product and a sintering aid to obtain a boron nitride sintered body including boron nitride particles and pores; and an impregnating step of impregnating the boron nitride sintered body with a resin composition, the composite body having the boron nitride sintered body and a resin filled in at least some of the pores of the boron nitride sintered body.

A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. Outer ends of the lower plates face and thermally couple to an electrical component. The upper plates and the lower plates are arranged in plate pairs. A spring element forces the upper plates and the lower plates of the plate pairs apart. The upper plates include upper limit tabs and the lower plates include lower limit tabs. The upper limit tabs and the lower limit tabs operate to limit spreading apart of the upper plates and the lower plates against the opening forces of the spring element.

A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

A printed wiring board includes a first outer surface, a second outer surface, and an electronic circuit. The second outer surface is opposite to the first outer surface. The electronic circuit includes at least one specific design circuit block and at least one common design circuit block. The at least one specific design circuit block is provided on the first outer surface and designed in accordance with a specification of a device to which the printed wiring board is applied. The at least one common design circuit block is for a common use regardless of the specification of the device. The at least one common design circuit block is provided on the second outer surface.

A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.