A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.

A printed circuit board (PCB) core structure is provided for the transition of signals from one side of a PCB to an opposing side of the PCB. The PCB core structure may include a laminated core including an inner core including a plurality of conductive layers (N layers), a first dielectric layer, a first conductive trace disposed over the Nth conductive layer on a first side of the laminated core. The PCB core structure may also include a signal via extending from a first conductive layer to an Nth conductive layer through the laminated core, the signal via configured to connect the first conductive trace to a pin or a second conductive trace on a second side of the laminated core. The PCB core structure may also include a shielding structure surrounding the signal via and partially extending from the first conductive layer to the Nth conductive layer. The PCB core structure may also include a cavity removing a portion of the shielding structure in the Nth conductive layer and filled with a dielectric material. The cavity filled with the dielectric material prevents the first conductive trace from shorting to the shielding structure. The PCB core structure may be fabricated by using a single-lamination cycle.

One embodiment provides an electronic circuit device, including: a first electronic circuit board; a second electronic circuit board separated from the first electronic circuit board; at least one capacitor including two electrodes, wherein one of the two electrodes is mounted to the first electronic circuit board and wherein the other of the two electrodes is mounted to the second electronic circuit board; and at least one connector electrically coupled to at least one of the first electronic circuit board and the second electronic circuit board. Other aspects are described and claimed.

A bearing structure for a high-low-voltage conversion circuit is disclosed and includes an insulation carrier, a first conductor layer, a second conductor layer, a first trench and a first insulation material. The first conductor layer and the second conductor layer are coated on the first surface and the second surface of the insulation carrier, respectively. A voltage difference is formed between the first conductor layer and the second conductor layer. The first trench is disposed on the first surface and surrounds an outer peripheral edge of the first conductor layer. The first conductor layer is extended from the first surface into the first trench, and the outer peripheral edge of the first conductor layer is located at a bottom of the first trench. The first insulation material covers the outer peripheral edge of the first conductor layer and is filled in the first trench.

Disclosed is a connector including at least: a printed circuit board including preferentially a plurality of stacked layers; a plurality of connecting pins which are spaced apart from each other and transversally pass through the printed circuit board from a bottom external surface up to an opposite top external surface of the printed circuit board; and an insulating assembly for providing insulation among the plurality of connecting pins, wherein the insulating assembly includes at least one insulator which is configured to be coupled to the printed circuit board and is configured to insulate at least a portion of each connection pin from a corresponding portion of one or more adjacent connecting pins of the plurality of connecting pins.

Disclosed is a connector including at least: a printed circuit board including preferentially a plurality of stacked layers; a plurality of connecting pins which are spaced apart from each other and transversally pass through the printed circuit board from a bottom external surface up to an opposite top external surface of the printed circuit board; and an insulating assembly for providing insulation among the plurality of connecting pins, wherein the insulating assembly includes at least one insulator which is configured to be coupled to the printed circuit board and is configured to insulate at least a portion of each connection pin from a corresponding portion of one or more adjacent connecting pins of the plurality of connecting pins.

An image forming apparatus includes an image forming portion, a frame, which is a part of a main assembly frame, extending along a predetermined plane, a cover provided outside of the frame and extending along the predetermined plane and a circuit board, provided between the frame and the cover with in a direction perpendicular to the predetermined plane and extending along the predetermined plane. An opening portion penetrating the circuit board is formed in the circuit board. The frame includes a first abutting portion protruding toward the circuit board and the cover includes a second abutting portion protruding toward the circuit board. The first and second abutting portions are opposite to each other via the circuit board and positioned in an area where the opening portion of the circuit board is sandwiched therebetween in the direction perpendicular to the predetermined plane.

This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.

A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 μm, and the thickness of the low dielectric glue layer is between 3 to 25 μm, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 μm. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.

Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.